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| D a t a S h e e t , R e v. 1 . 0 , M ar c h 2 00 9 TLE8262E U ni v e r s a l S y s t e m B as i s C h i p H ER M ES R ev . 1 . 0 A u to m o t i v e P o w e r TLE8262E Table of Contents Table of Contents 1 2 3 3.1 3.2 4 4.1 4.2 5 5.1 5.2 5.3 5.4 6 6.1 6.2 6.3 6.4 6.5 7 7.1 7.2 7.3 7.4 7.5 8 8.1 8.2 8.3 8.4 8.5 8.6 9 9.1 9.2 9.3 10 10.1 10.2 10.3 10.4 10.5 10.6 11 11.1 HERMES Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Pin Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Pin Definitions and Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 State Machine . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Block Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 State Machine Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 General Product Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Functional Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Current Consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Internal Voltage Regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Block Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Internal Voltage Regulator Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Internal Voltage Regulator Modes with SBC Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . External Voltage Regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Block Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . External Voltage Regulator Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . External Voltage Regulator State by SBC Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . High Speed CAN Transceiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Block Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . High-speed CAN Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . CAN Cell Mode with SBC Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Failure Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SPLIT Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . WK Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Block Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Wake-Up Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . LIN Transceiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Block Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . LIN Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . LIN Cell Mode with SBC Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Failure Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 16 17 18 19 21 21 21 21 22 23 24 24 24 24 25 27 29 29 29 32 33 34 36 40 40 40 42 43 43 43 45 46 47 49 Supervision Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 Reset Function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 2 Rev. 1.0, 2009-03-31 Data Sheet TLE8262E Table of Contents 11.2 11.3 12 12.1 12.2 12.3 12.4 12.5 13 13.1 13.2 13.3 13.4 13.5 13.6 14 14.1 14.2 15 15.1 15.2 15.3 15.4 15.5 15.6 15.7 16 16.1 16.2 16.3 17 18 Watchdog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 Interrupt Function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Interrupt Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Interrupt Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Interrupt Modes with SBC Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Interrupt Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Limp Home . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Limp Home output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Activation of the Limp Home Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Release of the Limp Home Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Vcc1C undervoltage time-out . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 60 64 64 64 65 66 66 66 67 67 67 69 Configuration Select . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 Configuration select . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 Config Hardware Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 Serial Peripheral Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SPI Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Corrupted data in the SPI data input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SPI Input Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SPI Output Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SPI Data Encoding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SPI Output Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ZthJA Curve . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hints for SBC Factory Flash Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ESD Tests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71 71 71 72 73 73 81 83 85 88 89 90 Package Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92 Data Sheet 3 Rev. 1.0, 2009-03-31 Universal System Basis Chip HERMES Rev. 1.0 TLE8262E 1 * * * * * * * * * * * * * * * * HERMES Overview Six products for complete scalable application coverage Complete compatibility (hardware and software) across the family TLE8264-2E (3LIN), TLE8263-2E (2LIN) - 3 Limp Home outputs TLE8264E (3LIN), TLE8263E (2LIN) - 1 Limp Home output TLE8262E (1LIN), TLE8261E (no LIN) - 1 Limp Home output Very low quiescent current in Stop and Sleep Modes Reset input, output Power on and scalable undervoltage reset generator Standard 16-bit SPI interface Overtemperature and short circuit protection Short circuit proof to GND and battery One universal wake-up input Wide input voltage and temperature range Cyclic wake in Stop Mode Green Product (RoHS compliant) AEC Qualified Scalable System Basis Chip Family Basic Features PG-DSO-36-38 Description The devices of the SBC family are monolithic integrated circuits in an enhanced power package with identical software functionality and hardware features except for the number of LIN cells. The devices are designed for CAN-LIN automotive applications e.g. body controller, gateway applications. To support these applications, the System Basis Chip (SBC) provides the main functions, such as HS-CAN transceiver and LIN transceivers for data transmission, low dropout voltage regulators (LDO) for an external 5 V supply, and a 16-bit Serial Peripheral Interface (SPI) to control and monitor the device. Also implemented are a Time-out or a Window Watchdog circuit with a reset feature, Limp Home circuitry output, and an undervoltage reset feature. The devices offer low power modes in order to support application that are connected permanent to the battery. A wake-up from the low power mode is possible via a message on the buses or via the bi-level sensitive monitoring/wake-up input as well as from the SPI command. Each wake-up source can be inhibited. The device is designed to withstand the severe conditions of automotive applications. Type TLE8262E Package PG-DSO-36-38 Marking TLE8262E Data Sheet 4 Rev. 1.0, 2009-03-31 TLE8262E HERMES Overview HS CAN Transceiver * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * Compliant to ISO 11898-2 and 11898-5 as well as SAE J2284 CAN data transmission rate up to 1 MBaud Supplied by dedicated input VccHSCAN Low power mode management Bus wake-up capability via CAN message Excellent EMC performance (very high immunity and very low emission) Bus pins are short circuit proof to ground and battery voltage 8 kV ESD gun test on CANH / CANL / SPLIT Bus failure detection LIN2.1 conformance, LIN2.1 is back compatible to LIN1.3 and LIN2.0 SAE J2602-2 conformance Compatible to ISO 9141 (K-L-Line) Transmission rate up to 20 kBaud, LIN Flash Mode 115kBaud 8 kV ESD gun test on Bus pins Low-dropout voltage regulator Vcc1C, 200 mA, 5 V 2% for external devices, such as microcontroller and RF receiver Vcc2, 200 mA, 5 V 2% for external devices or the internal HS CAN cell Vcc3, current limitation by shunt resistor (up to 400 mA with 220 m shunt resistor), 5 V 4% with external PNP transistor; for example: to supply additional external CAN transceivers Vcc1C, undervoltage Time-out Reset output with integrated pull-up resistor Time-out or Window Watchdog, SPI configured Watchdog Timer from 16 ms to 1024 ms Check sum bit for Watchdog configuration Reset due to Watchdog failure can be inhibited with Test pin (SBC SW Development Mode) Complete enabling / disabling of interrupt sources Timing filter mechanism to avoid multiple / infinite Interrupt signals Open drain Limp Home outputs Dedicated internal logic supply Maximum safety architecture for Safety Operation Mode Configurable Fail-Safe behavior LIN Transceiver Voltage Regulators Supervision Interrupt Management Limp Home Data Sheet 5 Rev. 1.0, 2009-03-31 TLE8262E Block Diagram 2 Block Diagram The simplified block diagram illustrates only the basic elements of the SBC devices. Please refer to the information for each device in the product family for more specific hardware configurations. VCC3S HUNT VCC3B AS E V CC3ref VCC1C VS VS VS VS Vcc1C Vcc2 V CC2 GND Vcc3 Vint. Vint. SDI SDO CLK CSN SPI SBC STATE MACHINE Limp Home Limp home INT Interrupt Control RESET GENERATOR WK RO WK Vs VCCHSCAN TxD CAN RxD CAN CAN_H SPLIT CAN_L WAKE REGISTER CAN cell LIN1 cell TxD1 RxD1 BUS1 GND Block diagram_TLE8262E.vsd Figure 1 Simplified Block Diagram Data Sheet 6 Rev. 1.0, 2009-03-31 TLE8262E Pin Configuration 3 3.1 Pin Configuration Pin Assignments RO CSN CLK SDI SDO GND n.c. Vs Vs Bus1 Vcc3shunt Vcc3base GND Vcc3REF INT Vcc1C Vcc2 VccHSCAN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 36 35 Test Limp home WK n.c. n.c. GND n.c. n.c. n.c. n.c. RxD LIN TxDLIN RxD CAN TxDCAN GND CANL SPLIT CANH TLE8262 DSO 36 - Exposed Pad 34 33 32 31 30 29 Exposed Die Pad 28 27 26 25 24 23 22 21 20 19 Pinout_8262.vsd Figure 2 Pin Configuration Data Sheet 7 Rev. 1.0, 2009-03-31 TLE8262E Pin Configuration 3.2 Pin 1 2 Pin Definitions and Functions Symbol RO CSN Function Reset Input/Output; open drain output, integrated pull-up resistor; active low. SPI Chip Select Not Input; CSN is an active low input; serial communication is enabled by pulling the CSN terminal low; CSN input should be set to low only when CLK is low; CSN has an internal pull-up resistor and requires CMOS logic level inputs. SPI Clock Input; clock input for shift register; CLK has an internal pull-down resistor and requires CMOS logic level inputs. SPI Data Input; receives serial data from the control device; serial data transmitted to SDI is a 16-bit control word with the Least Significant Bit (LSB) transferred first: the input has a pull-down resistor and requires CMOS logic level inputs; SDI will accept data on the falling edge of the CLK signal. SPI Data Output; this tri-state output transfers diagnostic data to the control device; the output will remain tri-stated unless the device is selected by a low on Chip Select Not (CSN). Ground Not connected Power Supply Input; block to GND directly at the IC with ceramic capacitor. Ensure to have no current flow from PIN8 to PIN9. PIN8 and PIN9 can be directly connected. Power Supply Input; block to GND directly at the IC with ceramic capacitor. Ensure to have no current flow from PIN8 to PIN9. PIN8 and PIN9 can be directly connected. LIN Bus 1; Bus line for the LIN interface, according to ISO. 9141 and LIN specification 2.1 as well as SAE J2602-2. PNP Shunt; External PNP emitter voltage. PNP Base; External PNP base voltage. Ground External PNP Output Voltage Interrupt Output, configuration Input; used as wake-up flag from SBC Stop Mode and indicating failures. Active low. Integrated pull up. During start-up used to set the SBC configuration. External Pull-up sets config 1/3, no external Pull-up sets config 2/4. Voltage Regulator Output; 5 V supply; to stabilize block to GND with an external capacitor. Voltage Regulator Output; 5 V supply; to stabilize block to GND with an external capacitor. Supply Input; for the internal HS CAN cell. CAN High Line; High in dominant state. Termination Output; to support recessive voltage level of the bus lines. CAN Low Line; Low in dominant state. Ground CAN Transmit Data Input; integrated pull-up resistor. CAN Receive Data Output LIN Transceiver Data input; according to ISO 9141 and LIN specification 2.1 as well as SAE J2602-2. integrated pull-up resistor. 8 Rev. 1.0, 2009-03-31 3 4 CLK SDI 5 SDO 6 7 8 9 10 11 12 13 14 15 GND n.c. Vs Vs Bus1 Vcc3 shunt Vcc3 base GND Vcc3REF INT 16 17 18 19 20 21 22 23 24 25 Vcc1 c Vcc2 VccHSCAN CANH SPLIT CANL GND TxDCAN RxDCAN TxDLIN Data Sheet TLE8262E Pin Configuration Pin 26 27 28 29 30 31 32 33 34 35 36 EDP Symbol RxDLIN n.c. n.c. n.c. n.c. GND n.c. Function LIN Transceiver Data Output; according to the ISO 9141 and LIN specification 2.1 as well as SAE J2602-2; push-pull output; LOW in dominant state. Not connected Not connected Not connected Not connected Ground Not connected not connected Monitoring / Wake-Up Input; bi-level sensitive input used to monitor signals coming from, for example, an external switch panel; also used as wake-up input; Fail-Safe Function Output; Open drain. Active LOW. SBC SW Development Mode entry; Connect to GND for activation; Integrated pullup resistor. Connect to VS or leave open for normal operation. Exposed Die Pad; For cooling purposes only, do not use it as an electrical ground.1) n.c WK Limp Home Test - 1) The exposed die pad at the bottom of the package allows better dissipation of heat from the SBC via the PCB. The exposed die pad is not connected to any active part of the IC and can be left floating or it can be connected to GND for the best EMC performance. Data Sheet 9 Rev. 1.0, 2009-03-31 TLE8262E State Machine 4 4.1 State Machine Block Description First battery connection (POR) AND config0 not active Condition / event SBC Init mode (256ms max after reset relaxation) SBC action Vcc1 on SPI cmd Vcc2/3 off CAN inact SPI cmd WD conf LIN inact SPI cmd L.H. inact SBC SW Flash mode WD trig reset (initiated by SBC ) SBC Normal mode Vcc1 on L.H. act/inact Vcc1 on L.H. act/inact Vcc2/3 on/off CAN Tx/Rx WD fixed LIN Flash mode Vcc2/3 on/off CAN conf WD conf LIN conf WD trig SPI cmd OR WD failed NOT reset clamped (high or low) OR NOT undervoltage at Vcc1 WK event stored LH entry condition stored OR Restart entry condition stored SPI cmd SPI cmd SPI cmd SBC Sleep mode Vcc1 off L.H. act/inact SBC Stop mode Vcc1 on L.H. act/inact Detection of falling edge at reset pin (any mode) OR undervoltage reset at VCC1C (any mode) Vcc2/3 off CAN Wakable/ off Wake up event WD off LIN Wakable/ off SPI cmd Vcc2/3 on/off CAN wakable/ off WD fixed/off WD trig LIN wakable/ off SBC Restart mode 1st (config1) or 2nd (config3) WD trig failure in Normal / Stop / SW Flash mode Config 1/3: Reset clamped LOW (any mode) Vcc1 on L.H. act/inact Vcc2/3 on/off CAN waked or off Reset act. LIN waked or off Init mode not successful Config 1/3: Reset clamped HIGH during restart / init First battery connection (POR) AND config0 SBC SW Development mode Vcc1 Vcc2/3 WD mode set mode set mode set L.H. CAN LIN mode set mode set mode set CAN, LIN, WK Wake-up OR Release of over temperature at Vcc1 (Wake-up event stored) (LH entry condition stored) SBC Fail-Safe mode 1st (config2) or 2nd (config4) WD trig failure in Normal / Stop / SW Flash mode Config 2/4: Reset clamped LOW (any mode) SBC Factory Flash mode Config 2/4: Reset clamped HIGH during Restart or Init mode Vcc1 off L.H. act Vcc2/3 off CAN sleep WD off LIN sleep Vcc1 ext. L.H. inact. Vcc2/3 off CAN off WD off LIN off Vcc1 over temperature shutdown OR V S > VUV_ON & Undervoltage time out on VCC1 Power mode managment.vsd Figure 3 Power Mode Management Data Sheet 10 Rev. 1.0, 2009-03-31 TLE8262E State Machine 4.2 State Machine Description The System Basis Chip (SBC) offers ten operating modes: Power On Reset, Init, Normal, Restart, Software Flash, Sleep, Stop, Fail-Safe, Software Development, and Factory Flash Mode. The modes are controlled with one test pin and via three mode select bits MS2..0, within the SPI. Additionally, the SBC allows five configurations, accessed via two external pins and one SPI bit. 4.2.1 Table 1 Configuration Description SBC Configuration Description Software Development Mode Test pin 0V INT Pin n.a WD to LH bit n.a Table 1 provides descriptions and conditions for entry to the different configurations of the SBC. Configuration config 0 config 1 config 2 config 3 After missing the WD trigger for the first time, the state of Vcc1C Open / VS External 0 remain unchanged, LH pin is active, SBC in Restart Mode pull-up After missing the WD trigger for the first time, Vcc1C turns OFF, LH pin is active, SBC in Fail-Safe Mode After missing the WD trigger for the second time, the state of Vcc1C remain unchanged, LH pin is active, SBC in Restart Mode After missing the WD trigger for the second time, Vcc1C turns OFF, LH pin is active, SBC in Fail-Safe Mode No ext. pull-up 0 External 1 pull-up No ext. pull-up 1 config 4 In SBC SW Development Mode, Config 1 to 4 are accessible. 4.2.2 SBC Power ON Reset (POR) At VS > VUVON, the SBC starts to operate, by reading the test pin and then by turning ON Vcc1C. When Vcc1C reaches the reset threshold VRT1, the reset output remains activated for tRD1 and the SBC enters then the Init Mode. In the event that Vs decreases below VUVOFF, the device is completely disabled. For more details on the disable behavior of the SBC blocks, please refer to the chapter specific to each block. 4.2.3 SBC Init Mode At entering the SBC Init Mode, the SBC starts to read the Test pin. The SBC starts-up in SBC Init Mode, and, after powering-up, waits for the microcontroller to finish its startup and initialization sequences. Vcc2/3 are OFF and the Watchdog is configurable but not active. CAN and LIN modules are inactive and Limp Home output is inactive. From this transition mode, the SBC can be switched via SPI command to the desired operating mode, SBC Normal or Software Flash Mode. If the SBC does not receive any SPI command, or receive wrong SPI command (i.e. not send the device to SBC Normal or SBC SW Flash Mode) within a 256 ms time frame after the reset relaxation, it will enter into SBC Restart Mode and activate the Limp Home output. Note: In Init Mode it is recommended to send one SPI command that sets the device to Normal Mode, triggers the watchdog the first time and sets the required watchdog settings. Data Sheet 11 Rev. 1.0, 2009-03-31 TLE8262E State Machine 4.2.4 SBC Normal Mode SBC Normal Mode is used to transmit and receive CAN and LIN messages. In this mode, Vcc1C is always "ON" Vcc2 and Vcc3 can be turned-on or off by SPI command. In Normal Mode the watchdog needs to be triggered. It can be configured via SPI, window watchdog and time-out watchdog is possible (default value is time-out 256 ms). All the wake-up sources can be inhibited in this mode. The Limp Home output can be enabled or disabled via SPI command. Via SPI command, the SBC can enter Sleep, Stop or Software Flash Mode. A reset is triggered by the SBC when entering the Software Flash Mode. It is recommended to send at first SPI command the watchdog setting. Please refer to Chapter 13.4. 4.2.5 SBC Sleep Mode During SBC Sleep Mode, the lowest power consumption is achieved by having the main and external voltage regulators switched-off. As the microcontroller is not supplied, the integrated Watchdog is disabled in Sleep Mode. The last Watchdog configuration is not stored. The CAN and LIN modules are in their respective Wake-capable or OFF modes and the Limp Home output is unchanged, as before entering the Sleep Mode. If a wake-up appears in this mode, the SBC goes into Restart Mode automatically. In Sleep Mode, not all wake-up sources should be inhibited, this is required to not program the device in a mode where it can not wake up. If all wake sources are inhibited when sending the SBC to Sleep Mode, the SBC does not go to Sleep Mode, the microcontroller is informed via the INT output, and the SPI bit "Fail SPI" is set. The first SPI output data when going to SBC Normal Mode will always indicate the wake up source, as well as the SBC Sleep Mode to indicate where the device comes from and why it left the state. Note: Do not change the transceiver settings in the same SPI command that sends the SBC to Sleep Mode. 4.2.6 SBC Stop Mode The Stop Mode is used as low power mode where the C is supplied. In this mode the voltage regulator Vcc1C remains active. The other voltage regulator (Vcc2/3) can be switched on or off. The watchdog can be used or switched off. If the watchdog is used the settings made in Normal Mode are also valid in Stop Mode and can not be changed. The CAN and LIN modules are not active. They can be selected to be off or used as wake-up source. If all wake up sources are disabled, (CAN, LIN, WK, cyclic wake) the watchdog can not be disabled, the SBC stays in Normal Mode and the watchdog continues with the old settings. If a wake-up event occurs the INT pin is set to low. The C can react on the interrupt and set the device into Normal Mode via SPI. There is no automatic transition to SBC Normal Mode. There are 4 Options for SBC Stop Mode * * * * WD on (the watchdog needs to be served as in Normal Mode WD off (special sequence required see Chapter 11.2.4) Cyclic Wake up with acknowledge (interrupt is sent after set time and needs to be acknowledged by SPI read) Cyclic Wake-up, Watchdog off (interrupt is sent after set time) Cyclic Wake-Up Feature SBC Stop Mode supports the cyclic wake-up feature. By default, the function is OFF. It is possible to activate the cyclic wake-up via "Cyclic WK on/off" SPI bit. This feature is useful to monitor battery voltage, for example, during parking of the vehicle or for tracking RF data coming via the RF receiver. The Cyclic Wake-up feature sends an interrupt via the pin INT to the C after the set time. The cyclic wake-up feature shares the same clock as the Watchdog. The time base set in the SPI for the Watchdog will be used for the cyclic wake-up. The timer has to be set before activating the function. With the cyclic wake-up feature the watchdog is not working as known from the other modes. In the case that both functions (Watchdog and cyclic wake-up) are selected, the cyclic wake-up is activated and each interrupt has to be acknowledged by reading the SPI Wake register before the next Cyclic Wake-Up comes. Otherwise, the SBC goes to SBC Restart Mode. Data Sheet 12 Rev. 1.0, 2009-03-31 TLE8262E State Machine 4.2.7 SBC Software Flash Mode SBC Software Flash Mode is similar to SBC Normal Mode regarding voltage regulators. In this mode, the Limp Home output can be set to active LOW via SPI and the communication on CAN and LIN modules is activated to receive flash data. In the LIN module the slope control mechanism is switched off. The Watchdog configuration is fixed to the settings used before entering the SBC SW Flash Mode. When the device comes from SBC Normal Mode, a reset is generated at the transition. From the SBC Software Flash Mode, the SBC goes into SBC Restart Mode, the config setting has no influence on the behavior. A mode change to SBC Restart Mode can be caused by a SPI command, a time-out or Window Watchdog failure or an undervoltage reset. When leaving the SBC Software Flash Mode a reset is generated. 4.2.8 SBC Restart Mode They are multiple reasons to enter the SBC Restart Mode and multiple SBC behaviors described in Table 2. In any case, the purpose of the SBC Restart Mode is to reset the microcontroller. * * * * * From SBC SW Flash Mode, it is used to start the new downloaded code. From SBC Normal, SBC Stop Mode and SBC SW Flash Mode it is reached in case of undervoltage on Vcc1C, or due to incorrect Watchdog triggering. From SBC Sleep Mode it is used to ramp up Vcc1C after wake From SBC Init Mode, it is used to avoid the system to remain undefined. From SBC Fail-safe Mode it is used to ramp up Vcc1C after wake or cool down of Vcc1C. From SBC Restart Mode, the SBC goes automatically to SBC Normal Mode. The delay time tRDx is programmable by the "Reset delay" SPI bit. The Reset output (RO) is released at the transition. SBC Restart Mode is left automatically by the SBC without any microcontroller influence. The first SPI output data will provide information about the reason for entering Restart Mode. The reason for entering Restart Mode is stored and kept until the microcontroller reads the corresponding "LH0..2" or "RM0..1" SPI bits. In case of a wake up from Sleep Mode the wake source is seen at the interrupt bits (Configuration select 000), an interrupt is not generated. Entering or leaving the SBC Restart Mode will not result in deactivation of the Limp Home output (if activated). The first SPI output data when going to SBC Normal Mode will always indicate the reason for the SBC Restart event. Data Sheet 13 Rev. 1.0, 2009-03-31 TLE8262E State Machine Table 2 Mode SBC Restart Mode Entry Reasons and Actions Actions LH output Init Mode time-out Reset low from outside Reset clamped undervoltage reset ON Unchanged ON unchanged ON WD trigger failure OFF after 1st remains ON LOW ON after 2nd OFF after 1st Reset low from outside Reset clamped undervoltage reset SPI cmd WD trigger failure Reset low from outside Reset clamped Wake-up event undervoltage reset Unchanged ON unchanged unchanged unchanged Unchanged ON unchanged unchanged ON WD trigger failure OFF after 1st remains ON LOW ON after 2nd OFF after 1st Reset low from outside Reset clamped Wake-up event undervoltage reset Reset low from outside Reset clamped Unchanged ON ON unchanged Unchanged ON remains ON LOW remains ON LOW ramping up ramping up LOW LOW remains ON LOW remains ON LOW remains ON LOW remains ON LOW remains ON LOW remains ON LOW remains ON LOW ramping up ramping up LOW LOW Config n.a SBC Mode and Configuration Entering reason Vcc1C RO SPI Out Bits LH 0..2 RM 0..1 LH 0..2 RM 0..1 LH 0..2 RM 0..1 after 1st LH 0..2 after 2nd RM 0..1 after 1st2) RM 0..1 LH 0..2 RM 0..1 RM 0..1 RM 0..1 RM 0..1 LH 0..2 WK bits register RM 0..1 LH 0..2 RM 0..1 after 1st LH 0..2 after 2nd RM 0..1 after 1st2) RM 0..1 LH 0..2 LH 0..2 RM 0..1 RM 0..1 LH 0..2 remains ON LOW remains ON LOW remains ON LOW ramping up LOW Init Mode n.a. config 1/3 n.a config 1 config 3 Normal1) config 4 n.a. config 1/3 n.a n.a Software Flash n.a n.a. config 1/3 Sleep n.a n.a config 1 config 3 Stop1) config 4 n.a. config 1/3 Fail-Safe Software Development Mode n.a. n.a n.a. config 1/3 remains ON LOW remains ON LOW 1) Config 2 will never enter Restart Mode in case of WD failure but directly Fail-Safe Mode 2) Goes to Fail-Safe Mode after the second consecutive failure Data Sheet 14 Rev. 1.0, 2009-03-31 TLE8262E State Machine 4.2.9 SBC Fail-Safe Mode In SBC Fail-Safe Mode, all voltage regulators are OFF and the transceivers are in Wake-Capable Mode. The Limp Home output is active. Conditions to enter the SBC Fail-Safe Mode are: * * * * Watchdog trigger failure in configuration 2 or 4 Vcc1C undervoltage time-out in any configuration if VS is above VLHUV range. Temperature shutdown of Vcc1C in any configuration. Reset clamped in Config. 2/4 In case of Vcc1C overtemperature shutdown, the SBC will latch and wait to cool down below the thermal hysteresis, and will go back to SBC Restart Mode. In case of a wake-up event, the SBC will go to SBC Restart Mode (not in case of Vcc1C overtemperature shutdown), storing the wake-up event and resetting the Watchdog trigger failure counter. The first SPI output data when going to SBC Normal Mode will always indicate the reason for the SBC Fail-Safe Mode. 4.2.10 SBC Software Development Mode If the Test pin is connected to GND (Config 0 active) during powering-up, the SBC enters SBC Software Development Mode. SBC Software Development Mode is a super set of the other modes so it is possible to use all the modes of the SBC with the following difference. In SBC Software Development Mode, no reset is generated and VCC1C is not switched off due to Watchdog trigger failure. If a Watchdog trigger failure occurs, it will be indicated by the INT output (reset bit). The SBC Fail-Safe Mode or SBC Restart Mode are not reached in case of wrong Watchdog trigger but the other reasons to enter these modes are still valid. 4.2.11 SBC Factory Flash Mode In this mode, the SBC is completely powered OFF and the microcontroller is supplied externally. The mode is detected when VCC1C is powered from external and the voltage on Vs is not powered from external. The current flow out of Vs must be limited to the maximum rating. The external supply voltage should be below the absolute maximum rating stated in Chapter 5.1. The reset can be driven by an external circuit, or pulled high with a pull-up resistor. Note: Please respect the absolute maximum ratings when the device is in SBC Factory Flash Mode. Data Sheet 15 Rev. 1.0, 2009-03-31 TLE8262E General Product Characteristics 5 5.1 General Product Characteristics Absolute Maximum Ratings Absolute Maximum Ratings 1) Tj = -40 C to +150 C; all voltages with respect to ground, positive current flowing into pin (unless otherwise specified) Pos. Parameter Symbol Limit Values Min. Voltages 5.1.1 5.1.2 5.1.3 5.1.4 5.1.5 Supply Voltage Max. 40 5 5.5 40 40 V V V V - - - CANH-CANL<|40 V|; CANH-SPLIT<|40 V| CANL-SPLIT<|40 V|; - - - - - 0 V < VS < 28 V 0 V < VCC1C < 5.5 V 0 V < VS < 28 V 0 V < VCC1C < 5.5 V - Unit Test Conditions VS dVS/dt Supply Voltage Slew Rate Regulator Output Voltage Vcc1C/2/3 CAN Bus Voltage (CANH, CANL) VCANH/L Differential Voltage CANH, CANL, SPLIT VdiffESD -0.3 -0.5 -0.3 -27 -40 V/s - 5.1.6 5.1.7 5.1.8 5.1.9 Input Voltage at VCCHSCAN Voltage at SPLIT, WK Voltage at Test Voltage at Vcc3base, Vcc3shunt, Vcc3REF 5.1.10 Voltage at Limp Home (LH, pin) 5.1.11 Logic Voltages Input Pin (SDI, CLK, CSN, TxDLINx, TxDCAN) 5.1.12 Logic Voltage Output PIN (SDO, RO, INT, RxDLINx, RxDCAN) 5.1.13 LIN Line Bus Input Voltages Currents 5.1.14 Reverse current on pin Vs Temperatures 5.1.15 Junction Temperature 5.1.16 Storage Temperature ESD Susceptibility VCCHSCAN VSPLIT VTest,max Vcc3base VLH VI VDRI,RD Vbus IVS Tj Tstg -0.3 -27 -0.3 -0.3 -0.3 -0.3 -0.3 -27 -500 -40 -55 -6 -2 5.5 40 40 40 40 V V V V V V V V mA C C kV kV V V VCC1C + 0.3V VCC1C + 0.3V 40 - 150 150 6 2 750 500 VS < VCC - - HBM (100 pF via 1.5 k) HBM (100 pF via 1.5 k) 3) 2) 2) 5.1.17 Electrostatic Discharge Voltage at BusX, VESD CANH, CANL, SPLIT versus GND 5.1.18 Electrostatic Discharge Voltage 5.1.19 Electrostatic Discharge CDM Corner Pins (Pin 1, 18, 19, 36) Electrostatic Discharge CDM VESD VESD_CDM -750 _C VESD_CDM -500 3) 1) Not subject to production test; specified by design 2) ESD susceptibility Human Body Model "HBM" according to JESD22-A114 3) ESD susceptibility Charged Device Model "CDM" according to ESDA STM5.3.1 Data Sheet 16 Rev. 1.0, 2009-03-31 TLE8262E General Product Characteristics Note: Stresses above the ones listed here may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Note: Integrated protection functions are designed to prevent IC destruction under fault conditions described in the data sheet. Fault conditions are considered as "outside" normal operating range. Protection functions are not designed for continuous repetitive operation. 5.2 Pos. 5.2.1 5.2.2 Functional Range Parameter Supply Voltage Supply Voltage Symbol Limit Values Min. Max. 28 40 V V After VS rising above VUV ON;1) 2) Unit Test Conditions VS VS VUV OFF VUV OFF tpulse = 400 ms 40 V load dump; Ri = 2 5.2.3 5.2.4 5.2.5 5.2.6 5.2.7 5.2.8 SPI Clock Frequency SPI Clock Frequency Junction Temperature Undervoltage "OFF" Undervoltage "ON Supply Voltage for Limp Home Output Active fclkSPI fclkSPI Tj VUV OFF VUV ON VS_LH - - -40 3 4.5 5.5 4 1 150 4 5.5 40 MHz MHz C V V V VS > 5.5 V If VUV ON> VS> VUV OFF; - -1) -1) Pull up to VS RLHO = 40k 3) 1) In the case Vs < VUVOFF, the SBC is switched OFF and will restart in INIT Mode at next Vs rising. 2) During load dump, the others pins remains in their absolute maximum ratings 3) Not subject to production test, specified by design Note: Within the functional range the IC operates as described in the circuit description. The electrical characteristics are specified within the conditions given in the related electrical characteristics table. Data Sheet 17 Rev. 1.0, 2009-03-31 TLE8262E General Product Characteristics 5.3 Pos. 5.3.1 Thermal Characteristics Parameter Junction Ambient Junction Ambient Symbol Min. Limit Values Typ. 40 25 5 145 25 185 35 1.20 - 10 - 10 - 170 - 200 - - 200 - 200 - Max. K/W K/W K/W C K C K - C K C K 1) 3) Unit Test Conditions 300 mm2 cooling area 2s2p + 600 mm2 cooling area 3) 2) 3) RthJA_1L RthJA_4L RthJSP TjPW TPW - - - 120 - 150 - - 150 - 150 - 5.3.2 5.3.3 5.3.4 5.3.5 5.3.6 5.3.7 5.3.8 5.3.9 5.3.10 5.3.11 Junction to Soldering Point Thermal Prewarning and Shutdown Junction Temperatures; VCC1C, Thermal Pre-warning ON Temperature -3) 3) VCC1C, Thermal Prewarning Hysteresis VCC1C, VCC2 Thermal Shutdown Temperature VCC1C, VCC2 Thermal Shutdown Hysteresis VCC1C, Ratio of SD to PW Temperature TjSDVcc TSDVcc 3) 3) TjSDVcc/ TjPW 3) CAN Transmitter Thermal Shutdown Temperature CAN Transmitter Thermal Shutdown Hysteresis TjSDCAN TCAN 3) 3) LIN Transmitter Thermal Shutdown TjSDLIN Temperature LIN Transmitter Thermal Shutdown TLIN Hysteresis 3) 3) 1) Specified Rthja value is according to Jedec JESD51-2,-5,-7 at natural convection on FR4 single layer. The product (chip + package) was simulated on a 76.4 x 114.3 x 1.5 mm board. 2) According to Jedec JESD51-2,-5,-7 at natural convection on 2s2p board for 2W. Board: 76.2x114.3x1.5mm with 2 inner copper layers (35m thick)., with thermal via array under the exposed pad contacted the first inner copper layer and 600mm2 cooling are on the top layer (70m) 3) Not subject to production test; specified by design; Data Sheet 18 Rev. 1.0, 2009-03-31 TLE8262E General Product Characteristics 5.4 Current Consumption VS = 5.5 V to 28 V; all outputs open; Without VCC3; Tj = -40 C to +150 C; all voltages with respect to ground; positive current defined flowing into pin; unless otherwise specified. Pos. Parameter Symbol Min. Normal Mode; 5.4.1 Current Consumption for Internal Logic Limit Values Typ. - Max. 2 mA SBC Normal Mode ICC1C = ICC2 = 0mA; CAN OFF mode; LIN OFF mode CAN Normal Mode; Recessive state; VCC2 connected to VCCHSCAN VTxD = Vcc1C; without RL CAN Normal Mode; dominant state; VCC2 connected to VCCHSCAN VTxD = low; without RL; LIN Normal Mode; recessive state; without RL; VTxD = Vcc1C LIN Normal Mode; dominant state; without RL; VTxD = low SBC Stop Mode; Vs = 13.5 V; VCC1C"ON"; VCC2/3"OFF" CAN/LIN wake capable; Tj = 25C Unit Test Condition IVS_logic - 5.4.2 IVS_CAN Additional current Consumption for CAN Cell - - 10 mA - - 12 mA 5.4.3 Additional Current IVS_LIN Consumption per LIN Cell - - 3.0 mA - - 5.0 mA Stop Mode 5.4.4 Current Consumption IVS - 58 75 A 65 - 70 85 90 A Tj = 85C1) SBC Stop Mode; Vs = 13.5 V; VCC1C/2"ON"; VCC3"OFF" CAN/LIN wake capable; Tj = 25C - 78 100 Tj = 85C1) Data Sheet 19 Rev. 1.0, 2009-03-31 TLE8262E General Product Characteristics 5.4 Current Consumption (cont'd) VS = 5.5 V to 28 V; all outputs open; Without VCC3; Tj = -40 C to +150 C; all voltages with respect to ground; positive current defined flowing into pin; unless otherwise specified. Pos. Parameter Symbol Min. Sleep Mode 5.4.5 Current consumption, all Wake Up Sources available. Limit Values Typ. 28 Max. 40 A SBC Sleep Mode; Tj = 25C Vs = 13.5 V; VCC1C/2/3"OFF" CAN/LIN wake capable; Tj = 85C1) A 1) Unit Test Condition IVS_sleep_ - SBC 32 5.4.6 Quiescent Current Reduction when one Wake Capable LIN Cell Disabled 50 - IVS_sleep_ 0.5 LIN 1 SBC Sleep Mode; Tj = 25C; VS = 13.5 V; VCC1C/2/3"OFF" CAN/LIN 1_2 wake capable; LIN3 OFF 1) 5.4.7 Quiescent Current Reduction when Wake Capable CAN Cell Disabled IVS_sleep_ 5 CAN 12 - A SBC Sleep Mode; Tj = 25C; VS = 13.,5 V; VCC1C/2/3"OFF" LIN 1..3 wake capable; CAN OFF 1) Not subject to production test; specified by design Data Sheet 20 Rev. 1.0, 2009-03-31 TLE8262E Internal Voltage Regulator 6 6.1 Internal Voltage Regulator Block Description V CC 1C Vs Vref V CC2 1 Overtemperature Shutdown State Machine Bandgap Reference INH Vref 1 Charge Pump GND INTE RNA L RE GULA TOR DIA GRA M V S D . Figure 4 Functional Block Diagram The internal voltage regulators are dual low-drop voltage regulators that can supply loads up to ICC1C/2_max. An input voltage up to VSMAX is regulated to Vcc1C/2_nom = 5.0 V with a precision of 2%. Due to its integrated reset circuitry, featuring two SPI configurable power-on timing (tRDx) and three SPI configurable output voltages (VRTx) monitoring, the device is well suited for microcontroller supply. The design enables stable operation even with ceramic output capacitors down to 470nF, with ESR < 1 @ f = 10 kHz. The device is designed for automotive applications, therefore it is protected against overload, short circuit, and overtemperature conditions. Figure 4 shows the functional block diagram. If the VS voltage is lower than VUV_OFF, the DMOS of the voltage regulator is switched to high impedance. The body diodes of the DMOS might go into conduction when VCC1C or VCC2 > VS (no reverse protection). 6.2 Internal Voltage Regulator Modes It is possible to turn Vcc1C via SBC Modes and Vcc2 activity ON or OFF via SPI command or by entering SBC modes. The limiting current for the both regulators is ICC1C_max/ICC2. 6.3 Internal Voltage Regulator Modes with SBC Mode Depending on the SBC Mode in use, Vcc1C and Vcc2 can be either ON or OFF by definition, Vcc2 can be also turned ON or OFF, via SPI. Table 3 identifies the possible states of the voltage regulators, based on the various SBC modes. Data Sheet 21 Rev. 1.0, 2009-03-31 TLE8262E Internal Voltage Regulator Table 3 SBC Mode INIT Mode Internal Voltage Regulators States Vcc1C ON ON OFF ON ON ON OFF OFF ON OFF unchanged ON ON OFF OFF OFF OFF Vcc2 Normal Mode Sleep Mode Restart Mode Software Flash Mode Stop Mode Fail-Safe Mode 6.4 6.4.1 Application information Timing Diagram Figure 5 shows the ramp up and down of the VS, and the dependency of Vcc1C. At the first ramp up from SBC Init Mode, the reset threshold VRT and time tRO are set to the default value. See Chapter 11.1 Vs VUV ON V UV OFF t Vcc1C VRTx,r VRTx,f GND t RO SBC OFF SBC Init Any mode SBC OFF t Figure 5 Ramp up / Down of Main Voltage Regulator An undervoltage time-out on Vcc1C is implemented. Refer to Chapter 13 for more information on this function. 6.4.2 Under voltage detection at Vcc2 The Vcc2 voltage regulator integrates an under voltage detection. When Vcc2 voltage goes below VUV_VCC2, the failure is indicated by an interrupt and the failure is reported into the diagnosis frame of the SPI. Data Sheet 22 Rev. 1.0, 2009-03-31 TLE8262E Internal Voltage Regulator 6.5 Electrical Characteristics Tj = -40 C to +150 C; all voltages with respect to ground; positive current defined flowing into pin; unless otherwise specified. Pos. Parameter Symbol Limit Values Min. Voltage Regulator; Pin Vcc1 C 6.5.1 6.5.2 6.5.3 6.5.4 6.5.5 Output Voltage Line Regulation Load Regulation Power Supply Ripple Rejection Output Current Limit Typ. 5.0 - - 40 - Max. 5.1 20 50 - 500 V mV mV dB mA 0 mA VCC1C VCC1C,Li VCC1C,Lo PSRR 4.9 - - - 200 Icc1C max Vr = 1 Vpp; fr = 100 Hz;1) Vcc1C = 4.5 V; power transistor thermally monitored; 6.5.6 6.5.7 6.5.8 6.5.9 6.5.10 6.5.11 Drop Voltage Output Voltage Line Regulation Load Regulation Power Supply Ripple Rejection Output Current Limit VDR Vcc1C VCC2 VCC2,Li VCC2,Lo PSRR - 4.9 - - - 200 - 5.0 - - 40 - 0.5 5.1 20 50 - 500 V V mV mV dB mA ICC1C = 150 mA; 2) 0 Icc2 Vr = 1 Vpp; fr = 100 Hz;1) Vcc2 = 4.5 V; power transistor thermally monitored; 6.5.12 6.5.13 Drop Voltage Under voltage detection on Vcc2 VDR_Vcc2 VUV_VCC2 - 4.5 - 4.65 0.5 4.8 V V ICC2 = 150 mA;2) VCC2 falls until INT = LOW 1) specified by design; not subject to production test. 2) Measured when the output voltage has dropped 100 mV from the nominal Value obtained at Vs = 13.5 V. Specified drop voltage for Vs > 4 V. Data Sheet 23 Rev. 1.0, 2009-03-31 TLE8262E External Voltage Regulator 7 7.1 External Voltage Regulator Block Description Vcc3 is activated via SPI. The external voltage regulator circuitry is designed to drive an external PNP transistor to increase output current flexibility. Four pins are used: VS, Vcc3base, Vcc3shunt and Vcc3ref. One transistor is tested during production. An input voltage up to VSMAX is regulated to VQ,nom = 5.0 V with a precision of 4%. The output current of the transistor is monitored via an external shunt resistor. The state of Vcc3 is reported in the diagnostic SPI register. When battery voltage is below the minimum operating battery voltage Vs < VVextUV, the external voltage regulator switches off. Figure 7 shows the behavior during this phase. The shunt is used for overcurrent limitation. If this feature is not needed, connect pins Vcc3shunt and Vs together. Since the junction temperature of the external PNP transistor cannot be read, it cannot be protected against over temperature by the SBC, and so the thermal behavior has to be checked by the application. VS Vcc3shunt Vcc 3base Vcc 3ref R BE V S-VCC3shunt > Vshunt_threshold ICC3base + - VREF State machine External voltage diagram .vsd Figure 6 Functional Block Diagram 7.2 External Voltage Regulator Mode It is possible to turn the Vcc3 ON or OFF via SPI command, depending on the SBC modes. Table 4 identifies the possible states, based on the different SBC modes. 7.3 External Voltage Regulator State by SBC Mode Table 4 shows the possible states of the Vcc3 external voltage regulator as a function of the SBC mode. Table 4 SBC Mode INIT Mode Normal Mode Sleep Mode Restart Mode SW Flash Mode Stop Mode Fail-Safe Mode Data Sheet External Voltage Regulator State by SBC Mode Vcc3 OFF ON OFF Unchanged ON ON OFF 24 Rev. 1.0, 2009-03-31 OFF OFF OFF TLE8262E External Voltage Regulator 7.4 7.4.1 Application Information Timing information Figure 7 shows the typical timing, ramp up and ramp down of the External Voltage Regulator, in regards to the VS pin. Vs V VextU V VU V_OFF Vcc3 Vcc 3 SPI t GND Undervoltage Managment vcc 3.vsd t Figure 7 Supply Voltage Management 7.4.2 External Components During production test, the listed parameter are tested with the PNP transistor MJD253 from ON semi. Characterization is done with the BCP52-16 from Infineon (ICC3<200 mA). Other PNP transistors can be used. Function must be checked in the application. Figure 8 shows the hardware set up used. VS V CC3 ICC3 C1 VS Vcc3shunt Vcc3base Vcc3ref RSHUNT T1 C2 RBE V S-V CC3shunt > Vshunt_threhold ICC3base + State machine V REF External voltage diagram_appli_note.vsd Figure 8 Hardware Set Up Data Sheet 25 Rev. 1.0, 2009-03-31 TLE8262E External Voltage Regulator Table 5 Device C2 RSHUNT T1 Bills of material for the VCC3 function Vendor Murata ON semi Reference / Value 10F/10V GCM31CR71AA106K 220m MJD253 7.4.3 Calculation of RSHUNT The maximum current ICC3max where the limit starts and the bit ICC3>ICC3max is set is determined by the shunt resistor RShunt and the Output Current Shunt Voltage Threshold Vshunt_threshold. The resistor can be calculated as following U shunt_threshold R SHUNT = -------------------------------------I CC3max 7.4.4 Unused Pins In case the Vcc3 is not used in the application, it is recommended to connect the unused pins of Vcc3 as followed. Connect Vcc1shunt to Vs. (It is also possible to leave the pin open) Leave Vcc3base open Leave Vcc3ref open Do not enable the Vcc3 via SPI as this leads to increased current consumption. Data Sheet 26 Rev. 1.0, 2009-03-31 TLE8262E External Voltage Regulator 7.5 Electrical Characteristics VS = 5.5 V to 28 V; SBC Normal Mode; all outputs open; Tj = -40 C to +150 C; all voltages with respect to ground; positive current defined flowing into pin; unless otherwise specified. Pos. Parameter Symbol Limit Values Min. Parameters independent from test set-up 7.5.1 External Regulator Control Drive Current Capability Input Current Vcc3ref Input Current Vcc3 Shunt Pin Typ. Max. 70 mA Unit Test Condition Icc3base 20 VCC3base = 28V 7.5.2 7.5.3 7.5.4 7.5.5 7.5.6 7.5.7 Icc3ref Icc3shunt VCC3,UV 10 10 4.0 25 25 4.25 100 110 - 50 50 4.5 250 130 5 A A V mV mV s Vcc3ref = 5 V Vcc3shunt = VS - VCC3 Undervoltage Detection VCC3 Undervoltage detection hysteresis Output Current Shunt Voltage Threshold Current increase regulation reaction time Current decrease regulation reaction time VCC3,UV, 20 hys Vshunt_thr 88 eshold 1) trIinc - Vcc3 = 6V to 0V; ICC3base,50% = 20mA Figure 9 7.5.8 7.5.9 7.5.10 7.5.11 trIdec - 0 - 5 5 2 5 s A A A Vcc3 = 0V to 6V; ICC3base,50% = 20mA Figure 9 Leakage current of Vcc3base Icc3base_lk when Vcc3 disabled Leakage current of Vcc3ref when Vcc3 disabled Leakage current of Vcc3shunt when Vcc3 disabled Base to emitter resistor External regulator minimum Vs voltage External regulator minimum Vs voltage hysteresis Icc3ref_lk -2 Icc3shunt_l k VCC3base = VS Tj = 25C VCC3ref = 5V Tj = 25C VCC3shunt = VS Tj = 25C VCC3base = VS - 0.3V VCC3 OFF 7.5.12 7.5.13 7.5.14 RBE VVextUV 50 4.5 100 0.2 200 5.5 - k V V VVextUVhy s Parameters dependent on the test set-up, according to the Figure 8 7.5.15 7.5.16 7.5.17 External Regulator Output Vcc3 Voltage Load Regulation Line Regulation VCC3,Li 4.8 5 5.2 50 50 V mV mV 0 mA 1) Threshold at which the current limitation starts to operate. 2) Tolerance includes load regulation and line regulation. Data Sheet 27 Rev. 1.0, 2009-03-31 TLE8262E External Voltage Regulator Timing diagram for regulator reaction time "current increase regulation reaction time" and "current decrease regulation reaction time" VCC3 t ICCbase ICC3base,50% trlinc trldec t Figure 9 Regulator Reaction Time Data Sheet 28 Rev. 1.0, 2009-03-31 TLE8262E High Speed CAN Transceiver 8 8.1 High Speed CAN Transceiver Block Description VccHSCAN SPI Mode Control CANH CANL VCC1C Driver Output Stage Temp.Protection + timeout RTD TxD CAN To SPI diagnostic V ccHS CAN RxD Diag VCC1C MUX RxDCAN SPLIT GND R SPLIT Receiver Vs V SPLIT Wake Receiver can block .vsd Figure 10 Functional Block Diagram 8.2 High-speed CAN Description The Controller Area Network (CAN) transceiver part of the SBC provides high-speed (HS) differential mode data transmission (up to 1 Mbaud) and reception in automotive and industrial applications. It works as an interface between the CAN protocol controller and the physical bus lines compatible to ISO/DIS 11898-2 and 11898-5 as well as SAE J2284. The CAN transceiver offers low power modes to reduce current consumption. This supports networks with partially powered down nodes. To support software diagnostic functions, a CAN Receive-only Mode is implemented. It is designed to provide excellent passive behavior when the transceiver is switched off (mixed networks, clamp15/30 applications). A wake-up from the CAN Wake capable Mode is possible via a message on the bus. Thus, the microcontroller can be powered down or idled and will be woken up by the CAN bus activities. Refer to Figure 11 for a description of the matching of the transceiver modes with the SBC mode. The CAN transceiver is designed to withstand the severe conditions of automotive applications and to support 12 V applications. Data Sheet 29 Rev. 1.0, 2009-03-31 TLE8262E High Speed CAN Transceiver 8.2.1 CAN Normal Mode To transfer the CAN transceiver into the CAN Normal Mode, an SPI word must be sent. This mode is designed for normal data transmission/reception within the HS CAN network. It can be accessed in Normal Mode of the SBC, as well as in SBC Software Flash Mode, and SBC Software Development Mode. Transmission The signal from the microcontroller is applied to the TxDCAN input of the SBC. The bus driver switches the CANH/L output stages to transfer this input signal to the CAN bus lines. Reduced Electromagnetic Emission To reduce electromagnetic emissions (EME), the bus driver controls CANH/L slopes symmetrically. Reception Analog CAN bus signals are converted into digital signals at RxD via the differential input receiver. In CAN Normal and CAN Receive Only Mode, the split pin is used to stabilize the Recessive Common Mode signal. The RxD pin is diagnosed and the detected failure is reported to the SPI diagnostic register. 8.2.2 CAN Wake Capable Mode This mode, which can be used in SBC Stop, Sleep, Restart and Normal Modes by programming via SPI and is automatically accessed in SBC Fail-Safe Mode, is used to monitor bus activities. A wake up signal on the bus results in different behavior of the SBC, as described in Table 6. After wake-up the transceiver can be switched to CAN Normal Mode for communication. To enable the CAN wakeable mode after a wake via CAN, the CAN transceiver must be switched to CAN Normal Mode, CAN Receive Only Mode or CAN Off, before switching to CAN Wakeable Mode again. Table 6 SBC Mode Sleep Mode Stop Mode Restart Mode Fail-Safe Mode Normal Mode Action Due to a CAN Wake Up SBC Mode after wake Restart Mode Stop Mode Restart Mode Restart Mode Normal Mode Vcc1C Ramping up ON Ramping up / ON Ramping up ON INT HIGH LOW 1) RxD LOW LOW LOW LOW LOW Int. Bit WK CAN 1 1 1 1 1 HIGH HIGH LOW 1) 1) When not masked via SPI Wake-Up in SBC Sleep Mode Wake-up is possible via a CAN message (filtering time t > tWU), it automatically transfers the SBC into the SBC Restart Mode and from there to Normal Mode the RxD pins in set to LOW, see Figure 11. The microcontroller is able to detect the low signal on RxD and to read the wake source out of the "Wake Register Interrupt" register (000) via SPI. No Interrupt is generated when coming out of Sleep Mode. Data Sheet 30 Rev. 1.0, 2009-03-31 TLE8262E High Speed CAN Transceiver CAN_H CAN_L BUS WAIT WAKE PATTERN Communication starts BUS OFF Vdiff t V cc1C/ HSCAN t tWU RxD CAN Wake capable mode RO SBC Sleep mode t CAN Waked CAN Normal mode t tROx SPI command SBC Restart SBC Normal mode t Application with sleep .vsd Figure 11 Timing during Transition from Sleep to Normal Mode Wake-Up in SBC Stop Mode In SBC Stop Mode, if a wake-up is detected, it is signaled by the INT output and by the "WK CAN" SPI bit. It is also signaled by RxDCAN put to low. The microcontroller should set the device to SBC Normal Mode, there is no automatic transition to Normal Mode. In Normal Mode the transceiver can be enabled via SPI. Wake-Up in SBC Restart or SBC Fail-Safe Mode In SBC Restart or SBC Fail-Safe Mode, if a wake-up is detected, it is signaled by the "WK CAN" SPI bit. Wake-Up in SBC Normal Mode In SBC Normal Mode, if a wake-up is detected, it is signaled by the "WK CAN" SPI bit and INT output, and RxD remains LOW. Data Sheet 31 Rev. 1.0, 2009-03-31 TLE8262E High Speed CAN Transceiver 8.2.3 CAN OFF Mode CAN OFF Mode, which can be accessed in the SBC Stop, Sleep, Restart and Normal modes, and automatically accessed in SBC Init and Factory Flash modes, is used to completely stop CAN activities. In CAN OFF Mode, a wake up event on the bus will be ignored. 8.2.4 CAN Receive Only Mode In CAN Receive Only Mode (RxD only), the driver stage is de-activated but reception is still operational. This mode is accessible by an SPI command. 8.2.5 CAN Cell in Disabled State During disable state, when Vs < VUV_OFF, the CAN cell does not have enough supply voltage. In this state, the CANH and CANL pins are set to high impedance, to guarantee passive behavior. The maximum current that can flow in the CANH and CANL pins in this mode are specified by ICANH,lk and ICANL,lk. 8.3 CAN Cell Mode with SBC Mode Table 7 shows all the CAN modes accessible to the current SBC Mode. Automatic transition from one CAN mode to an other is only allowed in the same column. . Table 7 SBC Mode INIT Mode HS CAN States, Based on SBC modes CAN Mode OFF OFF OFF OFF OFF Wake capable Normal Wake capable Wake capable Wake capable Wake capable Normal Receive only Normal Mode Stop Mode Sleep Mode Restart Mode Fail-Safe Mode SW Flash Mode 8.3.1 SBC Normal Transition to Sleep or Stop Mode During the transition from SBC Normal to Sleep or Stop Modes, the receiver module is deactivated and replaced by the low power mode receiver for wake-up capability. The next message can be only a wake-up call. It is possible to set the SBC directly from SBC Normal Mode (with CAN Normal Mode) to SBC Sleep or Stop Mode, but this is not recommended, because a wake pattern on the CAN network that could occurs during SPI communication could get lost. It is preferable, in SBC Normal Mode to first send the CAN transceiver into CAN Wake Capable Mode, and then set the entire device to SBC Sleep or Stop Mode. In the unlikely case that the device would see a wake up call during the transmission order "SBC go to sleep", the device will store this event and bypass the "SBC go to sleep" command to go back into SBC Restart Mode. Do not change the Transciever setting with the same SPI command that is used to sent the device to Sleep Mode. 8.3.2 Transition from SBC Sleep to other Modes In SBC Sleep Mode, a wake-up on the CAN cell will set the SBC to Restart Mode automatically if the CAN Wake Capable Mode of the SBC is selected via SPI. Figure 11 shows the typical timing. Data Sheet 32 Rev. 1.0, 2009-03-31 TLE8262E High Speed CAN Transceiver 8.4 Failure Detection All failures are reported in the SPI diagnostic encoder, the TxD time-out is reported as TxD shorted to GND. In case of local failure and Bus Dominat Clamped failure, the transceiver is automatically switched to the CAN Receive only Mode. 8.4.1 TxD Time-out Feature If the TxD signal is dominant for a time t > tTxD, the TxD time-out function deactivates the transmission of the signal at the bus. This is implemented to prevent the bus from being blocked permanently due to an error. The transmission is released after switching the CAN to Active Mode via SPI. Refer to Figure 12. TxD Time -out Interrupt SPI setting : CAN Normal Mode TxD CAN VC C1C GND t tTxD_TO Vdiff t Txd timeout .vsd Figure 12 TxD Time-out diagram 8.4.2 Bus Dominant Clamping If the HS CAN bus signal in dominant for a time t > tBUS_TO, a bus dominant clamping is detected. The CAN transceiver is switched to Receive Only Mode. The failure is signaled via SPI. If the bits are not masked the INT pin is set to low. For operation the transceiver needs to be switched back to Normal Mode via SPI. 8.4.3 TxD to RxD Short Circuit Feature Similar to the TxD time-out, a TxD to RxD short circuit would also block the bus communication. To avoid this, the CAN transceiver provides TxD to RxD short circuit detection. In this case, it is recommended to switch OFF the SBC HS CAN supply (e.g. Vcc2) via SPI command to prevent disturbances on the CAN bus. This failure is reported into the diagnostic frame of the SPI. The INT pin is set LOW if not disabled via SPI. The transmitter is automatically inhibited and goes back to normal operation after a SPI command. 8.4.4 Overtemperature The driver stages are protected against overtemperature. Exceeding the shutdown temperature results in deactivation of the CAN transceiver. The CAN transceiver is activated gain after cooling down, the device stays in CAN Active Mode. To avoid a bit failure after cooling down, the signals can be transmitted again only after a dominant to recessive edge at TxD. Figure 13 shows how the transmission stage is deactivated and activated again. First, an overtemperature condition causes the CAN transceiver to be deactivated. After the overtemperature condition is no longer present, the transmission is released automatically after the TxD bus signal has changed to recessive level. Data Sheet 33 Rev. 1.0, 2009-03-31 TLE8262E High Speed CAN Transceiver Failure Overtemp ON Overtemperature OFF t TxDCAN VCC1C GND Vdiff D Recessive Dominant t R t Figure 13 Release of the Transmission after Overtemperature 8.4.5 Permanent RxD Recessive Clamping If the RxD signal is permanently recessive (such as shorted to Vcc1C), although there is a message sent on the bus, the host microcontroller of this transceiver could start a message at any time because the bus appears to be idle. To prevent this node from disturbing communication on the bus, the SBC offers permanent RxD recessive clamping. If the RxD signal is permanently recessive, the failure is diagnosed and the transmitter is deactivated as long as the error occurs. The transmitter is reactivated after an SPI command. 8.4.6 VccHSCAN Undervoltage The CAN transceiver cell has no dedicated under voltage detection and use the VCC2 or VCC3 under voltage circuitry. The C can switch of the CAN in case of undervoltage. 8.4.7 Bus failures In case one of the following bus failures is detected by the SBC the interrupt bit CAN BUS is set to "1" and an interrupt is generated, if not masked. The CAN transceiver does not change the mode due to a detected bus failure. Bus Failures * * * * * * CANH short to GND CANH short to Vs CANH short to Vcc CANL short to GND CANL short to Vs CANL short to Vcc A short of CANH to CANL is detected by the microcontroller as the signal sent on TxD is not received on RxD. 8.5 SPLIT Circuit SPLIT circuitry is activated during CAN Normal and Receive Only Mode and de-activated (SPLIT pin high ohmic) during CAN Wake Capable and OFF Modes. The SPLIT pin is used to stabilize the recessive common mode signal in Normal Mode and RxD Only Mode. This is achieved with a stabilized voltage of 0.5 x VccHSCAN typical at SPLIT. A correct application of the SPLIT pin is shown in Figure 14. The SPLIT termination for the left and right nodes is implemented with two 60 resistors and one 10 nF capacitor. The center node in this example is a stub node and the recommended value for the split resistances is 1.5 k. Data Sheet 34 Rev. 1.0, 2009-03-31 TLE8262E High Speed CAN Transceiver In the case the application doesn't request the SPLIT pin feature, the pin has to be left open. CANH CANH TLE 8264 SPLIT 10nF 60Ohm 60Ohm TLE 6251 DS SPLIT 10nF split termination 60Ohm CAN Bus split termination 60Ohm CANL 10nF CANL split termination at stub 1,5 kOhm 1,5 kOhm CANH SPLIT CANL TLE 6251 G NERR Figure 14 . Application example for the SPLIT Pin Data Sheet 35 Rev. 1.0, 2009-03-31 TLE8262E High Speed CAN Transceiver 8.6 Electrical Characteristics 4.75 V < VccHSCAN < 5.25 V; VS = 5.5 V to 28 V; RL = 60 ; CAN Normal Mode; Tj = -40 C to +150 C; all voltages with respect to ground; positive current flowing into pin; unless otherwise specified. Pos. Parameter Symbol Min. CAN Bus Receiver 8.6.1 Differential Receiver Threshold Voltage, recessive to dominant edge Differential Receiver Threshold Voltage, dominant to recessive edge Common Mode Range Differential Receiver Hysteresis CANH, CANL Input Resistance Differential Input Resistance Wake-up Receiver Threshold Voltage, recessive to dominant edge Wake-up Receiver Threshold Voltage, dominant to recessive edge Wake-up Receiver Differential Receiver Hysteresis Limit Values Typ. 0.80 Max. 0.90 V Unit Test Condition Vdiff,rd_N - Vdiff = VCANH - VCANL CAN Normal Mode 8.6.2 Vdiff,dr_N 0.50 0.60 - V Vdiff = VCANH - VCANL CAN Normal Mode 8.6.3 8.6.4 8.6.5 8.6.6 8.6.7 CMR -12 - 110 20 40 0.8 12 - 30 60 1.15 V mV k k V - CAN Normal Mode Recessive state Recessive state CAN Wake Capable Mode Vdiff,hys_N - Ri Rdiff 10 20 Vdiff, rd_W - 8.6.8 Vdiff, dr_W 0.4 0.7 - V CAN Wake Capable Mode 8.6.9 Vdiff, hys_W - 120 - mV CAN Wake Capable Mode Data Sheet 36 Rev. 1.0, 2009-03-31 TLE8262E High Speed CAN Transceiver 8.6 Electrical Characteristics (cont'd) 4.75 V < VccHSCAN < 5.25 V; VS = 5.5 V to 28 V; RL = 60 ; CAN Normal Mode; Tj = -40 C to +150 C; all voltages with respect to ground; positive current flowing into pin; unless otherwise specified. Pos. Parameter Symbol Min. CAN Bus Transmitter 8.6.10 8.6.11 CANH/CANL Recessive Output Voltage Limit Values Typ. - - Max. 3.0 50 V mV CAN Normal Mode no load CAN Normal Mode VTxD = Vcc1C; no load CAN Normal Mode VTxD = 0 V; VccHSCAN = 5 V CAN Normal Mode VTxD = 0 V; VccHSCAN = 5 V CAN Normal Mode VTxD = 0 V; VccHSCAN = 5 V CAN Normal Mode VTxD = 0 V; VccHSCAN = 5 V RL = 50 CAN Normal Mode Unit Test Condition VCANL/H 2.0 -500 CANH, CANL Recessive Vdiff_r_N Output Voltage Difference Vdiff = VCANH - VCANL CANL Dominant Output Voltage CANH Dominant Output Voltage 8.6.12 VCANL VCANH 0.5 - 2.25 V 8.6.13 2.75 - 4.5 V 8.6.14 CANH, CANL Dominant Vdiff_d_N Output Voltage Difference Vdiff = VCANH - VCANL CANH, CANL Dominant Vdiff_d_N Output Voltage Difference Vdiff = VCANH - VCANL CANH Short Circuit Current CANL Short Circuit Current Leakage Current 1.5 - 3.0 V 8.6.15 1.5 - 3.0 V 8.6.16 8.6.17 8.6.18 ICANHsc ICANLsc ICANH,lk ICANL,lk VSPLIT ISPLIT -200 50 - -80 80 2 -50 200 - mA mA A VCANHshort = 0 V CAN Normal Mode VCANLshort = 18 V VS = VccHSCAN = 0 V; 0 V < VCANH,L< 5 V CAN Normal Mode -500 A < ISPLIT < 500 A CAN Wake capable Mode; -27 V < VSPLIT < 40 V -1) CAN Normal Mode IRxD(CAN) = -2 mA; CAN Normal Mode IRxD(CAN) = 2 mA; SPLIT Termination Output; Pin SPLIT 8.6.20 8.6.21 8.6.22 8.6.23 8.6.24 SPLIT Output Voltage Leakage Current 0.3 x -5 - 0.8 x - VccHSCAN VccHSCAN VccHSCAN 0 600 - - 5 - - 0.2 x A V V 0.5 x 0.7 x V SPLIT Output Resistance RSPLIT HIGH level Output Voltage VRxD,H LOW Level Output Voltage Receiver Output RxD VCC1C Vcc1C V V VRxD,L Transmission Input TxD 8.6.26 8.6.27 HIGH Level Input Voltage VTD,H Threshold LOW Level Input Voltage Threshold - 0.3 x - - 0.7 x - Vcc1C CAN Normal Mode recessive state CAN Normal Mode dominant state VTD,L Vcc1C Data Sheet 37 Rev. 1.0, 2009-03-31 TLE8262E High Speed CAN Transceiver 8.6 Electrical Characteristics (cont'd) 4.75 V < VccHSCAN < 5.25 V; VS = 5.5 V to 28 V; RL = 60 ; CAN Normal Mode; Tj = -40 C to +150 C; all voltages with respect to ground; positive current flowing into pin; unless otherwise specified. Pos. 8.6.28 8.6.29 8.6.30 8.6.31 Parameter TxD Input Hysteresis TxD Pull-up Resistance Min. Dominant Time for Bus Wake-up Propagation Delay TxD-to-RxD LOW (recessive to dominant) Symbol Min. Limit Values Typ. 0.12 x Max. - 80 5 255 mV k s ns 1) Unit Test Condition VTD,hys RTD tWU td(L),TR - 20 0.75 - Vcc1C 40 3 150 - CAN Wake capable Mode CAN Normal Mode CL = 47 pF; RL = 60 ; VccHSCAN = 5 V; CRxD = 15 pF CAN Normal Mode CL = 47 pF; RL = 60 ; VccHSCAN = 5 V; CRxD = 15 pF CAN Normal Mode CL = 47 pF; RL = 60 ; VccHSCAN = 5 V CAN Normal Mode CL = 47 pF; RL = 60 ; VccHSCAN = 5 V CAN Normal Mode CL = 47 pF; RL = 60 ; VccHSCAN = 5 V; CRxD = 15 pF CAN Normal Mode CL = 47 pF; RL = 60 ; VccHSCAN = 5 V; CRxD = 15 pF CAN Normal Mode CAN Normal Mode1) Dynamic CAN-Transceiver Characteristics 8.6.32 Propagation Delay TxD-to-RxD HIGH (dominant to recessive) td(H),TR - 150 255 ns 8.6.33 Propagation Delay td(L),T TxD LOW to bus dominant - 50 120 ns 8.6.34 Propagation Delay TxD HIGH to bus recessive td(H),T - 50 120 ns 8.6.35 Propagation Delay td(L),R bus dominant to RxD LOW - 100 135 ns 8.6.36 Propagation Delay bus recessive to RxD HIGH td(H),R - 100 135 ns 8.6.37 8.6.38 TxD Permanent Dominant tTxD_TO Time-out Bus Dominant Time-out 0.3 0.3 0.6 0.6 1.0 1.0 ms ms tBUS_TO 1) Not subject to production test; specified by design. Data Sheet 38 Rev. 1.0, 2009-03-31 TLE8262E High Speed CAN Transceiver V TxD Vcc1C GND V DIFF t d(L),T V diff, rd_N t d(H),T t V diff, dr_N t d(L),R V RxD V cc1C t d(H),R td(H),TR 0.8 x V cc1C t t d(L),TR GND 0.2 x V cc1C t CA N dy namic c harac teris tics .v sd Figure 15 Timing Diagrams for Dynamic Characteristics Data Sheet 39 Rev. 1.0, 2009-03-31 TLE8262E WK Pin 9 9.1 WK Pin Block Description Internal supply I PU_MON IWK State machine I PD_MON Wake.vsd Figure 16 Functional Block Diagram The internal voltage regulator (Vcc1C) and the entire SBC can wake up by changing the wake input voltage. The WK input pin is a bi-level sensitive input. This means that both transitions, HIGH to LOW and LOW to HIGH, result in a wake-up. The filtering time is tWK, f.The wake-up capability can be enabled or disabled via SPI command. In case of reverse polarity, no special protection must be set if the absolute maximum rating is respected. When the SBC is below the minimum VUVOFF, (SBC OFF Mode) the pin WK is at high impedance; a wake event will be ignored. The state of the WK pin (low or high) can always be read in Normal Mode, Stop Mode and SW Flash Mode at the bit WK State. When setting the bit "WK PIN on/off" to 1, the device wakes up from Sleep Mode with a high to low or low to high transition. From Fail-Safe Mode the device will always go to Restart Mode with a high to low or low to high transition. If the bit "WK PIN on/off" is set to 1 in Normal, Stop or SBC SW Flash Mode the interrupt bits "WK 0 WK pin" and/or "WK 1 WK pin" are set in case of a change on the WK pin and an interrupt is generated if not masked. With the bits "WK 0 WK pin" and "WK 1 WK pin" the interrupt for low to high transition and high to low transition can be masked separately. 9.2 Wake-Up Timing Figure 17 shows typical wake-up timing and parasitic filtering. The filtering time is tWK, f.. This is used to avoid a parasitic wake-up due to EMC disturbances. Specifically, the voltage transition on pin WK must be higher than the VWK,TH and longer than tWK,f to be understood as a wake-up signal. Data Sheet 40 Rev. 1.0, 2009-03-31 TLE8262E WK Pin VWK V WK,th V WK,th t t WK,f No Wake Event t WK,f Wake Event Wake Pin Diagram .vsd Figure 17 Wake-up Timing 9.2.1 Transition from Normal to Sleep Mode. The SBC can not be sent from Normal Mode to Sleep Mode with uncleared interrupt in the WK interrupt bits "WK 0 WK pin" and "WK 1 WK pin". This is implemented to avoid that a wake information from the WK pin gets lost during the transition from Normal to Sleep Mode. If a wake up appears during the C sets the SBC to Sleep Mode, the SBC will wake up directly after going to Sleep Mode. There is no difference if the bits "WK 0 WK pin" or "WK 1 WK pin" bit were set during the transition or were just not cleared before sending the SPI command for Sleep Mode, the SBC will wake-up after entering the Sleep Mode. Therefore it always needs to be ensured that the bits are cleared before sending the SBC to Sleep Mode. Data Sheet 41 Rev. 1.0, 2009-03-31 TLE8262E WK Pin 9.3 Electrical Characteristics VS = 5.5 V to 28 V; Tj = -40 C to +150 C; all voltages with respect to ground; positive current defined flowing into pin; unless otherwise specified. Pos. 9.3.1 9.3.2 9.3.3 9.3.4 9.3.5 9.3.6 Parameter WK Input Threshold Voltage Input Hysteresis WK Filter Time Input Current WK pin pull up current WK pin pull down current Symbol Min. Limit Values Typ. 3 - - - - - Max. 4 0.7 25 2 -3 30 V V s A A A - - 2 0.1 10 -2 Unit Test Condition VWK,th VI, hys. tWK, f IWK I PU_MON -30 I PD_MON 3 VWK = 0 V; VWK > 5V VWK = 3.8 V VWK = 2 V Data Sheet 42 Rev. 1.0, 2009-03-31 TLE8262E LIN Transceiver 10 LIN Transceiver The SBC includes up to three LIN blocks, but this chapter describes only one because all three LIN block are completely identical. 10.1 Block Description VS SPI Mode Control Driver R BUS TxD Input Vcc1C R TD Output Stage Temp.Protection Current Limit Timeout TxDx BUSx To SPI Diagnostic RxD Diag Receiver Filter Vcc1C Vs Wake Receiver RxDx LIN BLOCK.VSD Figure 18 Functional Block Diagram 10.2 LIN Description The LIN transceiver cells of the SBC is an interface between the protocol controller and the physical bus. It is especially suitable for driving the bus line in LIN systems in automotive and industrial applications. It is compatible to LIN 2.1 as well as SAE J2602-2. To reduce current consumption, the LIN transceiver offers a LIN Wake Capable Mode and a LIN OFF Mode. The LIN transceiver has a bus short to GND feature implemented to avoid a battery discharge. The transceiver offers very good EMC performance within a broad frequency range independent of battery voltage. This is achieved by implementing a slope control mechanism based on a constant slew rate. In case the Vs < VUVOFF, the LIN bus pin has high impedance and the maximum current which can flow in is set to IBUSlk 10.2.1 LIN Normal Mode In this mode, it is possible to transmit and receive messages on each BusX. The LIN transceiver enters the LIN Normal Mode after the microcontroller sends an SPI word (see Chapter 15) and also by entering SBC Software Flash Mode. Data Sheet 43 Rev. 1.0, 2009-03-31 TLE8262E LIN Transceiver 10.2.2 Slope Selection The LIN transceiver offers a LIN Low Slope Mode for 10.4 kBaud communication and a LIN Normal Slope Mode for 20 kBaud communication. The only difference is the behavior of the transmitter. In LIN Low Slope Mode, the transmitter uses a lower slew rate to further reduce the EME compared to Normal Mode. This complies with SAE J2602 requirements. The selection is done for all transceivers at the same time so that the chip is working in either LIN Low slope Mode or in LIN Normal Slope Mode. By default, the device works in LIN Low Slope Mode. The selection of LIN Normal Slope Mode is done by an SPI word. The selection is accessible in SBC Normal Mode only. 10.2.3 LIN OFF Mode In this mode, the LIN transceiver is completely disabled. Only an SPI command can reactivate the LIN cell. This mode is accessible in SBC Normal, Stop, and Sleep Modes and is the default behavior in SBC Init Mode. 10.2.4 LIN Wake Capable Mode This mode, which can be used in SBC Stop, Sleep, Restart and Normal Modes by programming via SPI and is automatically accessed in SBC Fail-Safe Mode, is used to monitor bus activities. A wake up signal on the bus results in different behavior of the SBC, as described in Table 8. After wake-up the transceiver can be switched to LIN Normal Mode for communication. To enable the LIN Wakeable Mode after a wake via this LIN tranceiver, the deticated LIN transceiver must be switched to LIN Normal Mode, LIN Receive Only Mode or LIN Off, before switching to LIN Wakeable Mode again. Table 8 SBC Mode Sleep Mode Stop Mode Action Due to a CAN Wake Up SBC Mode after wake Restart Mode Stop Mode Restart Mode Restart Mode Normal Mode Vcc1C Ramping up ON Ramping up / ON Ramping up ON INT HIGH LOW1) HIGH HIGH LOW 1) RxD LOW LOW LOW LOW LOW Int. Bit WK CAN 1 1 1 1 1 Restart Mode Fail-Safe Mode Normal Mode 1) When not masked via SPI Wake-Up in SBC Sleep Mode Wake-up is possible via a LIN message (filtering time t > tWK,bus), it automatically transfers the SBC into the SBC Restart Mode and from there to Normal Mode the corresponding RxD pins in set to LOW, see Figure 19. The microcontroller is able to detect the low signal on RxD and to read the wake source out of the "Wake Register Interrupt" register (000) via SPI. No Interrupt is generated when coming out of Sleep Mode. The C can now switch the CAN transceiver into LIN Normal Mode via SPI to start communication. Wake-Up in SBC Stop Mode In SBC Stop Mode, if a wake-up is detected, it is signaled by the INT output and by the "WK LINx" SPI bit. It is also signaled by RxDLINx put to low.The microcontroller should set the device to SBC Normal Mode, there is no automatic transition to Normal Mode. In Normal Mode the transceiver can be enabled via SPI. Data Sheet 44 Rev. 1.0, 2009-03-31 TLE8262E LIN Transceiver 10.2.5 LIN Receive Only Mode In LIN Receive Only Mode (RxD only), the driver stage is de-activated but reception is still possible. This mode is accessible by an SPI command. 10.2.6 LIN Flash Mode In LIN Flash Mode, the slope control mechanism is de-activated. This mode is accessible only in the SBC SW Flash mode. A communication up to 100kbaud is possible. 10.3 LIN Cell Mode with SBC Mode Table 9 shows the LIN modes accessible in the different SBC modes. Automatic transition from one LIN mode to an other is only allowed in the same column. Table 9 SBC Mode INIT Mode Normal Mode Sleep Mode Restart Mode Stop Mode Fail-Safe Mode SW flash Mode LIN States Based on SBC Modes LIN Mode OFF OFF OFF OFF OFF Wake capable Flash Wake capable Wake capable Wake capable Wake capable Normal / Low slope Receive Only Data Sheet 45 Rev. 1.0, 2009-03-31 TLE8262E LIN Transceiver V BUSX Communication starts WAKE PATTERN t tWU BUS Idle Vcc 1C t RxD SPI command LIN Wake capable mode Reset (RO) SBC Sleep mode LIN Waked LIN Normal mode t t RDx SBC Restart mode SBC Normal mode t LIN WK from sleep to normal .vsd Figure 19 Timing during Transition from SBC Sleep to SBC Normal Mode 10.3.1 Transition from SBC Normal to Sleep / Stop Mode It is recommended to first set the LIN Wake Capable Mode before setting the SBC Sleep or Stop Mode to avoid missing a wake up event. The reason is identical to the CAN behavior. For additional information, see Chapter 8.3.1. Do not change the Transciever setting with the same SPI command that is used to sent the device to Sleep Mode. 10.4 10.4.1 Application Information Bus Short to GND Feature The LIN transceiver has a feature implemented to protect the battery from running out of charge in case of a bus short to GND. When the LIN transceiver is switched to Wake capable or Off, the internal pull-up resistor is switched off to prevent a large current from flowing to GND. In addition, the transceiver only wakes up on a dominant-torecessive edge on the LIN bus, so with the bus shorted to GND the transceiver does not wake up. 10.4.2 Oscillator Tolerance As required by LIN 2.1, an oscillator clock tolerance < 2% for the protocol handler is possible with LIN transceiver. 10.4.3 LIN Specification The device fulfills the Physical Layer Specification of LIN 2.1. The device fulfills the Physical Layer Specification SAE J2602-2. Data Sheet 46 Rev. 1.0, 2009-03-31 TLE8262E LIN Transceiver 10.5 Failure Detection All failures are reported in the SPI Diagnostic Encoder except the TxD time-out feature, reported as TxD shorted to GND and over temperature, which is not reported. In case of failure, the transceiver is automatically switched to the LIN Receive only mode. The reactivation of the transmitter appears only after the microcontroller has requested it via SPI, except the over temperature. In this particular case, the transmitter is reactivated after a transition from dominant to recessive. 10.5.1 TxD Time-out Feature If the TxD signal is dominant for a time t > tTxD_TO, the TxD time-out function deactivates the transmission of the signal at the bus. This is done to prevent the bus from being permanently blocked due to an error. The transmission is released by sending the SPI command for LIN Normal Mode. Refer to Figure 20. . TxDLIN VCC1C TxD Time -out Interrupt SPI setting : LIN Normal Mode GND t tTxD_TO VBUS t LIN Txd timeout .vsd Figure 20 TxD Time-out Diagram 10.5.2 Bus Dominant Clamping If the LIN bus signal in dominant for a time t > tLIN_TO, a bus dominant clamping is detected. The LIN transceiver is switched to Receive Only Mode. The failure is signaled via SPI. If the bits are not masked, the INT pin is set to low. For operation the transceiver needs to be switched back to Normal Mode via SPI. 10.5.3 TxD to RxD Short Circuit Feature Similar to the TxD Time-out, a TxD to RxD short circuit would also block the bus communication. To avoid this, the LIN transceiver has TxD to RxD short circuit detection. This failure is reported to the diagnostic frame of the SPI. The transmitter is automatically inhibited and is reactivated after an SPI command. 10.5.4 Overtemperature Figure 21 shows how the transmission stage is deactivated and activated again. The driver stages are protected against overtemperature. Exceeding the shutdown temperature results in deactivation of the driving stages. Nevertheless, the SBC can still receive messages via the RxD output, by setting automatically the LIN into LIN Receive Only Mode. To avoid a bit failure after cooling down, the signals can be transmitted again only after a dominant to recessive edge at TxD. An overtemperature condition causes the transmission stage to deactivate. After the overtemperature condition is no longer present, transmission is reactivated after the TxD bus signal has changed to recessive level. The failure is not indicated in the SPI and doesn't generate any interrupt. Data Sheet 47 Rev. 1.0, 2009-03-31 TLE8262E LIN Transceiver Failure Overtemp ON Overtemperature OFF t TxDLIN VCC1C GND VLIN D Recessive Dominant t R t Figure 21 Release of the Transmission after Overtemperature 10.5.5 Permanent RxD Recessive Clamping If the RxD signal is permanently recessive (for example, shorted to Vcc1C), although there is a message sent on the bus, the host microcontroller of this transceiver could start a message at any time, because the bus appears to be idle. To prevent this node from disturbing communication on the bus, the SBC offers permanent RxD recessive clamping. If the RxD signal is permanently recessive, the failure is diagnosed and the transmitter is deactivated as long as the error occurs. The transmitter is reactivated only after a SPI command. Data Sheet 48 Rev. 1.0, 2009-03-31 TLE8262E LIN Transceiver 10.6 Electrical Characteristics VS = 6 to 18 V1); RL = 500 ; Tj = -40 C to +150 C; all voltages with respect to ground; positive current flowing into pin; unless otherwise specified. Pos. Parameter Symbol Min. Receiver Output RxDX Push Pull 10.6.1 HIGH level Output Voltage LOW Level Output Voltage Limit Values Typ. - Max. - V LIN Normal Mode IRxD(LIN) = -1.6 mA; Vbus = VS LIN Normal Mode IRxD(LIN) = 1.6 mA; Vbus = 0 V LIN Normal Mode recessive state 3) Unit Test condition VRxD,H VRxD,L 0.8 x VCC1C - - 0.2 x V 10.6.2 Vcc1C Transmission Input TxDX 10.6.3 10.6.4 10.6.5 10.6.6 HIGH Level Input Voltage Threshold Input Hysteresis VTxD,H VTxD,hys - - 0.3 x 20 - 0.12 x 0.7 x - - 80 V V V k Vcc1C Vcc1C - LOW Level Input Voltage VTxD,L Threshold Pull-up Resistance Vcc1C 40 LIN Normal Mode dominant state RTD VTxD = 0 V Data Sheet 49 Rev. 1.0, 2009-03-31 TLE8262E LIN Transceiver 10.6 Electrical Characteristics (cont'd) VS = 6 to 18 V1); RL = 500 ; Tj = -40 C to +150 C; all voltages with respect to ground; positive current flowing into pin; unless otherwise specified. Pos. Parameter Symbol Min. Bus Receiver BusX 10.6.7 Receiver Threshold Voltage, recessive to dominant edge Receiver Dominant State Receiver Threshold Voltage, dominant to recessive edge Receiver Recessive State Limit Values Typ. 0.45 x Max. - V LIN Normal Mode Unit Test condition VBus,rd 0.42 x VS - - VS - 10.6.8 10.6.9 VBus,dom VBus,dr 0.42 x V V VS VS LIN Normal Mode (LIN 2.1 Param. 17) LIN Normal Mode 0.55 x VS - 0.58 x 10.6.10 10.6.11 10.6.12 VBus,rec 0.58 x - V V V VS VS VS LIN Normal Mode (LIN 2.1 Param. 18) LIN Normal Mode (LIN2.1 Param. 19) LIN Normal Mode Vbus,hys = Vbus,rec - Vbus,dom (LIN2.1 Param. 20) LIN Wake Capable Mode LIN Wake Capable Mode Receiver Center Voltage VBus,c Receiver Hysteresis 0.475 x 0.07 x 0.5 x VS 0.525 x VS VS VBus,hys 0.1 x VS 0.175 x 10.6.13 10.6.14 Wake-up Threshold Voltage Dominant Time for Bus Wake-up VBus,wk tWK,Bus 0.40 x VS 30 0.5 x VS 0.6 x VS V - 150 s Data Sheet 50 Rev. 1.0, 2009-03-31 TLE8262E LIN Transceiver 10.6 Electrical Characteristics (cont'd) VS = 6 to 18 V1); RL = 500 ; Tj = -40 C to +150 C; all voltages with respect to ground; positive current flowing into pin; unless otherwise specified. Pos. Parameter Symbol Min. Bus Transmitter BusX 10.6.15 10.6.16 10.6.17 Bus Serial Diode Voltage Vserdiode Drop Bus Recessive Output Voltage Bus Dominant Output Voltage 0.4 0.7 1.0 V V V LIN Normal Mode VTxD = VCC1C LIN Normal Mode VTxD = VCC1C LIN Normal Mode VTxD = 0 V; VS = 7V; RL = 500 ; LIN Normal Mode VS = 18 V; RL = 500 ; LIN Normal Mode VTxD = 0 V; VS = 7V; RL = 1k; LIN Normal Mode VS = 18 V; RL = 1 k; LIN Normal Mode VBUS = 13.5 V; (LIN2.1 Param. 12) Limit Values Typ. Max. Unit Test condition VBus,ro VBus,do 0.8 x VS - - - VS 1.2 - - 2.0 V 10.6.18 Bus Dominant Output Voltage VBus,do 0.6 - - V 0.8 - - V 10.6.19 Bus Short Circuit Current IBus,sc 40 100 150 mA 10.6.20 Leakage Current IBus,lk -1000 -450 - A VS = 0 V; VBUS = -12 V; (LIN2.1 Param. 15) - - 5 A VS = 0 V; VBUS = 18 V; (LIN2.1 Param. 16) -1 - - mA VS = 18 V; VBUS = 0 V; (LIN2.1 Param. 13) - - 5 A VS = 8 V; VBUS = 18 V; (LIN2.1 Param. 14) 10.6.21 10.6.22 Bus Pull-up Resistance LIN Output Current RBus IBus 20 -60 30 -30 47 -5 k A LIN Normal Mode (LIN2.1 Param. 26) LIN Wake Capable / OFF Mode; VS = 18 V; VBUS = 0V Data Sheet 51 Rev. 1.0, 2009-03-31 TLE8262E LIN Transceiver 10.6 Electrical Characteristics (cont'd) VS = 6 to 18 V1); RL = 500 ; Tj = -40 C to +150 C; all voltages with respect to ground; positive current flowing into pin; unless otherwise specified. Pos. Parameter Symbol Min. Dynamic Transceiver Characteristics BusX 10.6.30 Propagation Delay, bus dominant to RxD LOW Propagation Delay, bus recessive to RxD HIGH Receiver Delay Symmetry Limit Values Typ. 1 Max. 6 s Unit Test condition td(L),R - Vcc1C = 5 V; CRxD = 20 pF; (LIN2.1 Param. 31) Vcc1C = 5 V; CRxD = 20 pF; (LIN2.1 Param. 31) tsym,R = td(L),R - td(H),R; (LIN2.1 Param. 32) VTxD = 0 V 3) 3) 10.6.31 td(H),R - 1 6 s 10.6.32 10.6.34 10.6.35 10.6.36 10.6.37 tsym,R -2 6 6 - 0.396 - 12 12 10 - 2 20 20 - - s ms ms s TxD Dominant Time-out tTxD_TO BUS Dominant Time-out tLIN_TO TxD Dominant Time-out ttorec Recovery Time Duty Cycle D1 (for worst case at 20 kBit/s) tduty1 LIN Normal slope Mode; duty cycle 12) THRec(max) = 0.744 x VS; THDom(max) =0.581 x VS ; VS = 7.0 ... 18 V; tbit = 50s; D1 = tbus_rec(min)/2 tbit; (LIN2.1 Param. 27) 10.6.38 Duty Cycle D2 (for worst case at 20 kBit/s) tduty2 - - 0.581 LIN Normal slope Mode; duty cycle 22) THRec(min)= 0.422 x VS ; THDom(min)= 0.284 x VS VS = 7.6 ... 18 V; tbit = 50s; D2 = tbus_rec(max)/2 tbit; (LIN2.1 Param. 28) Data Sheet 52 Rev. 1.0, 2009-03-31 TLE8262E LIN Transceiver 10.6 Electrical Characteristics (cont'd) VS = 6 to 18 V1); RL = 500 ; Tj = -40 C to +150 C; all voltages with respect to ground; positive current flowing into pin; unless otherwise specified. Pos. 10.6.39 Parameter Duty Cycle D3 (for worst case at 10.4 kBit/s) Low Slope Mode Symbol Min. Limit Values Typ. - Max. - LIN Low slope Mode; duty cycle 32) THRec(max) = 0.778 x 0.417 Unit Test condition tduty3 VS; THDom(max) =0.616 x VS ; VS = 7.0 ... 18 V; tbit = 96s; D3 = tbus_rec(min)/2 tbit; (LIN2.1 Param. 29) 10.6.40 Duty Cycle D4 (for worst case at 10.4 kBit/s) Low Slope Mode tduty4 - - 0.590 LIN Low slope Mode; duty cycle 42) THRec(min)= 0.389 x VS ; THDom(min)= 0.251 x VS VS = 7.6 ... 18 V; tbit = 96s; D4 = tbus_rec(max)/2 tbit; (LIN2.1 Param. 30) 10.6.41 LIN Input Capacitance 15 pF 3) 1) LIN specification is defined between 6 V and 18 V only. 2) Bus load conditions concerning LIN spec 2.0 Cbus, Rbus = 1 nF, 1 k / 6.8 nF, 660 / 10 nF, 500 3) Not subject to production test, specified by design Data Sheet 53 Rev. 1.0, 2009-03-31 TLE8262E Supervision Functions 11 11.1 11.1.1 Supervision Functions Reset Function Description The reset output pin RO provides information to the microcontroller, for example, in the event that the output voltage has fallen below the undervoltage threshold VRT1/2/3. When connecting the SBC to battery voltage, the reset signal remains LOW initially. When the output voltage Vcc1C has reached the reset threshold VRT1,r, the reset output RO remains LOW for the reset delay time trd1. After that the RO is released to HIGH. A reset can also occur due to faulty Watchdog refresh.See Chapter 11.2. The reset threshold as well as the reset delay time can be adjusted via SPI. The RO pin has an integrated pull-up resistor. 11.1.2 Reset diagnosis The RO pin is diagnosed for both short circuit to Vccx and GND. Depending on the configuration, in case of RO failure, the SBC goes to SBC Fail-Safe or Restart Mode and activate the Limp Home output. In case of short circuit to GND, it is detected in any SBC mode except SBC Restart Mode. At the falling edge of the RO, when supposed to be HIGH, the SBC enters automatically the SBC Restart Mode. If after the trd and RO relaxation, the RO pin is still LOW, then the SBC detects the clamping to LOW failure. The microcontroller is in permanent reset. In case of short circuit to Vccx, the SBC cannot detect the short circuit before a reset should occur. So reset clamped is detected when the SBC goes to SBC Restart Mode or during Init Mode. 11.1.3 VCC Reset Timing VRTx t < t RR undervoltage tRD1 tLW tCW SPI Init WD Trigger tCW tOW WD Trigger tOW tRDx tCW tLW SPI Init t SPI RO tRR t t SBC Init SBC Normal SBC Restart SBC Normal Res_per_8264.vsd Figure 22 Data Sheet Reset Timing Diagram 54 Rev. 1.0, 2009-03-31 TLE8262E Supervision Functions 11.1.4 Reset from Outside If the reset pin RO is pulled to low from outside while no reset low is issued by the SBC, the device goes to Restart Mode. In Restart Mode an reset is issued by the SBC, the RO pin is set to low for the time tRD1 or tRD2. If the RO pin is pulled to low for longer time Reset clamped is detected. 11.2 Watchdog Two different Watchdogs are possible in the SBC. It can be either a Window Watchdog or a Time-out Watchdog. The Watchdog can also be inhibited in SBC Stop Mode and SBC SW Flash Mode via SPI. The Watchdog timing is programmed via SPI command. As soon as the Watchdog is activated, the timer starts running and the Watchdog must be served. Please refer to Table 10 to match the SBC Modes with the Watchdog Modes. The default setting for the Watchdog is Time-out Watchdog with a 256 ms timer. The long open window allows the microcontroller to run its initialization sequences and then to trigger the Watchdog via the SPI. The Watchdog is served by a SPI bit and should toggle with the correct frequency. The default value is a 0, so the first trigger bit must be a 1. In case of a Watchdog reset, the Watchdog immediately starts with a long open window when entering SBC Normal Mode. With the reset the watchdog bit is set to 0, so the first watchdog trigger after reset is a change to 1. In SBC Software Development Mode, no reset is generated due to watchdog failure, if a watchdog failure occurs it is indicated by the SPI Reset bit and via INT pin. All watchdog modes are accessible in regards to the normal operation modes. Table 10 SBC Mode INIT Mode Normal Mode Software Flash Mode Stop Mode Sleep Mode Fail-Safe Mode Restart Mode Watchdog Functionality by SBC Modes Watchdog Mode Watchdog Programmable; Watchdog is not active. Remarks INIT Mode should be left in less than 256 ms (see Chapter 13) WD Programmable; - Time-out or Window Watchdog Mode is fixed Mode is fixed OFF OFF OFF SBC retains the set-up as in the mode before entering the Software Flash Mode SBC retains the set up as in the mode before entering the Stop Mode SBC does not retain the set-up. SBC does not retain the set-up SBC will start default Watchdog setting (256ms Time-out Watchdog) when entering Normal Mode. Data Sheet 55 Rev. 1.0, 2009-03-31 TLE8262E Supervision Functions 11.2.1 Time-out Watchdog The Time-out Watchdog is an easier and less secure type of watchdog. Compared to the Window Watchdog there is no closed window existing. The watchdog trigger can be done any time within the watchdog time. A watchdog trigger is detected as a write access to the "WD Refresh" within the SPI control word. The bit needs to be toggle (transition HIGH to LOW or LOW to HIGH) within the watchdog window. The trigger is accepted when the CSN input becomes HIGH. A correct watchdog trigger starts a new window. The period is selected via the Window Watchdog timing bit field in the range of 16 ms to 1024 ms. For the safe trigger area the tolerance of the oscillator has to be taken into consideration, so the safe trigger time is below 90% of the programmed Watchdog time. It is possible to refresh the Watchdog with any SPI programming with the mode selection Normal, Stop, SW Flash or Read Only. Should the trigger signal not meet the window, depending on the configuration, the SBC will go to SBC Restart Mode or to Fail-Safe Mode. A watchdog reset is created by setting the reset output RO low. In config 1 and config 3 the watchdog starts again in Normal Mode with the default watchdog setting (256ms Time-out Watchdog). The watchdog failure can be read at the bits RM0, RM1, LH0, LH1, LH2 via SPI. 11.2.2 Window Watchdog A Watchdog trigger is detected as a write access to the "WD Refresh" within the SPI control word. The bit needs to be toggle (transition HIGH to LOW or LOW to HIGH) in the open window. The trigger is accepted when the CSN input becomes HIGH. A correct Watchdog trigger results in starting the Window Watchdog by a closed window with a width of typically 50% of the selected Window Watchdog reset period. This period, selected via the Window Watchdog timing bit field, is in the range of 16 ms to 1024 ms. This closed window is followed by an open window, with a width of typical 50% of the selected period. From now on, the microcontroller must serve the Watchdog by periodically toggling the Watchdog bit. This bit toggling access must meet the open window. The tolerance of the oscillator has to be taken into consideration, so the safe window to trigger the Watchdog is from 55% to 90% of the programmed Window Watchdog time. It is possible to refresh the Watchdog with any SPI programming with the mode selection Normal, Stop, SW Flash or Read Only. A correct Watchdog service immediately results in starting the next closed window (see Figure 23, safe trigger area). Should the trigger signal not meet the open window, depending on the configuration the SBC will go to SBC Restart Mode or to Fail-Safe Mode. A watchdog reset is created by setting the reset output RO low (see Figure 24). In config 1 and config 3 the watchdog starts again in Normal Mode with the default watchdog setting (256ms Time-out Watchdog). The watchdog failure can be read at the bits RM0, RM1, LH0, LH1, LH2 via SPI. Data Sheet 56 Rev. 1.0, 2009-03-31 TLE8262E Supervision Functions Window Watchdog Timing (SPI) tWD tCWmax tCWmin closed window Uncertainty tOWmax tOWmin open window uncertainty t / [t WDPER] 0.45 0.55 safe trigger area 0.9 1.0 1.1 Wd1_per .vsd Figure 23 Window Watchdog Definitions tCW tOW t CW+tOW tLW tLW tCW tOW tCW tLW tCW tOW WD Refresh bit tCW tOW RO tWDR t Watchdog timer reset t normal operation Time-out (too long) normal operation timeout (too short) normal operation Wd2_per.vsd Figure 24 Window Watchdog Timing Diagram for config 1 and config 3 11.2.3 Changing the Watchdog Settings The settings of the watchdog can be changed during the operation of the watchdog. The change is done with a SPI programming into the Watchdog Configuration Register. The new setting is programmed together with a valid watchdog trigger according to the old settings. The timer with the new settings starts with this SPI command. The toggling of the "WD Refresh" bit needs to be continued (transition HIGH to LOW or LOW to HIGH) with the new settings. If the new settings were not valid, the watchdog will continue with the old settings and generate a "Wrong WD Set" interrupt. Data Sheet 57 Rev. 1.0, 2009-03-31 TLE8262E Supervision Functions 11.2.4 Inhibition of the watchdog During SBC Stop Mode and SBC SW Flash Mode, it is possible to deactivate the watchdog. To avoid unwished deactivation of the watchdog, a special protocol has to be followed, prior deactivating the watchdog. Please refer to Figure 25. In the case the exact process below is not respected, the SBC remains in the previous state, and an interrupt is generated (if not inhibited), and the Wrong WD set bit in the SPI is set. When the microcontroller requests the SBC to go back to SBC Normal Mode, the Watchdog is reactivated. The watchdog settings that were valid before entering Stop Mode with watchdog off are valid. The watchdog timer starts with entering Normal Mode. In case window watchdog was selected the watchdog starts with a closed window. When setting the WD Refresh bit to 0 for the command that sends the device to Normal Mode the first watchdog trigger is a change to 1. As in Stop Mode the watchdog settings can not be changed, it is also not possible to change the watchdog settings with the command that sets the SBC from Stop Mode into Normal Mode. First battery connection (POR) AND config0 not active SBC Init mode (256ms max after reset relaxation) WD conf WD not active SPI cmd SBC Normal mode Cyclic WK ON / OFF SPI cmd = SBC SW Flash mode &,WD OFF WD trig WD conf WD active SPI cmd = SBC Normal mode & WD OFF & WD Trigger SBC Normal mode WD active SPI cmd = SBC SW Flash mode &,WD OFF & WD Trigger SPI cmd = SBC Stop mode & WD OFF & WD Trigger SBC SW Flash mode WD OFF SBC Stop mode Cyclic WK ON / OFF WD OFF inhibition of the WD .vsd Figure 25 Inhibition of the watchdog During SBC Stop Mode, when the cyclic wake feature is used and the watchdog is not disabled, it is necessary that the microcontroller acknowledges the interrupt by reading the SPI Wake register before the next Cyclic Wake occures. Otherwise, a reset is performed by setting the SBC to SBC Restart Mode. Data Sheet 58 Rev. 1.0, 2009-03-31 TLE8262E Supervision Functions 11.3 Electrical Characteristics VS = 5.5 V to 28 V; Tj = -40 C to +150 C; SBC Normal Mode; all voltages with respect to ground; positive current defined flowing into pin; unless otherwise specified. Pos. Parameter Symbol Limit Values Min. Reset Generator; Pin RO 11.3.1 Reset Threshold Voltage, VRT1,f 4.5 4.6 3.5 3.6 3.2 3.3 250 1.25 1.55 20 - 4.65 4.75 3.65 3.75 3.35 3.45 - - - 100 0.2 4.75 4.85 3,75 3,85 3.45 3.55 - - - 200 0.4 V V V V V V mV V V mV V default setting, Vcc falling default setting, Vcc rising SPI option;Vcc falling SPI option; Vcc rising SPI option;VS 4 V; Vcc falling SPI option; VS 4 V, Vcc rising default setting1) Unit Max. Test Condition Typ. VRT1,r VRT2,f VRT2,r VRT3,f VRT3,r Reset Threshold Voltage Headroom 11.3.2 11.3.3 Reset Threshold Hysteresis VRT1_HR VRT2_HR VRT3_HR VRT,hys SPI option;1) SPI option; VS 4 V 1) - Reset Low Output Voltage VRO 11.3.4 11.3.5 11.3.6 11.3.7 Reset High Output Voltage Reset Pull-up Resistor Reset Reaction Time Reset Delay Time VRO RRO tRR tRD1 tRD2 0.7 x - 20 10 5.0 500 256 0 VCC1C 10 4 4.5 450 - -10 VCC1C + 0.3 V 40 26 5.5 550 - 10 V k s ms s ms % IRO = 1 mA for VCC1C = VRT1/2/3; IRO = 200 A for VRT1/2/3> VCC1C 1 V IRO = -20A VRO = 0 V VCC1C < VRT1/2 to RO = L default SPI setting; after Power-On-Reset SPI setting option 2) Watchdog Generator 11.3.8 11.3.9 Long Open Window Internal Oscillator tolerance tLW fCLKSBC default setting Internal Oscillator - 1) Headroom between actual output voltage on VCC1C and Reset Threshold Voltage for falling Vcc. 2) Specified by design; not subject to production test. Tolerance defined by internal oscillator tolerance fCLKSBC. Data Sheet 59 Rev. 1.0, 2009-03-31 TLE8262E Interrupt Function 12 12.1 Interrupt Function Interrupt Description The interrupt pin has a general purpose function to point out to the microcontroller either a wake up, a failure condition or the switch on of a voltage regulator. Table 11 shows the possible interrupt sources in the device, and Figure 26 gives the hardware set-up. The interrupt function is designed to inform the microcontroller of any wakeup event, overtemperature or overtemperature pre-warning as well as other failures. These events turn the INT pin to active LOW. All interrupt sources can be masked via a SPI bit, then no interrupt is generated for this event. For failures on under-voltage the interrupt is dual-sensitive. This means that an interrupt is generated when the failure appears, as well as when the failure disappears. For failures on over-temperature, communication failures and voltage regulator over current and undervoltage, the dedicated SPI interrupt bit indicated first the interrupt source and then the state of the device. So, the bit is set to failure 1 at the event, and remains latched at least until the microcontroller reads the bit. For the SBC failure (Wrong WD Setting, Reset, Fail SPI) and wake events, the INT indicates only an event and the bit is cleared with a dedicated SPI read. The INT pin is released when an SPI read is done to Interrupt Register 000 with a "Read Only" command, or after interrupt time out tINTTO. If the interrupt cause was a wake event, the interrupt bit can be read in Interrupt Register 000 and the bit is cleared. If it was an other interrupt source the bit INT is set, and interrupt register 001 and 010 need to be read. With a "Read Only"command the event triggered interrupt bits are cleared. The INT bit will be set to "0" when all bits in interrupt register 001 and 010 are set to "0". If an interrupt is masked (bit set to "0") only the interrupt does not occur, the interrupt bit in the SPI is shown. Figure 26 shows a simplified diagram of the INT output. In Init Mode before RO goes high the INT pin is used to set the configuration of the device to config 1/3 or config 2/4, see Chapter 14. V cc 1C RINT Interrupt logic Time out INT INTERRUPT BLOCK.VSD Figure 26 Table 11 Interrupt Block Diagram Interrupt sources INT Activation Rising Rising Rising Rising Rising SPI bit OTP VCC1C OT VCC2 OT HSCAN State Interrupt sources Temperature Over temperature pre-warning VCC1C Over temperature VCC2 Over temperature HS CAN Communication failure CAN Failure LIN Failure Voltage regulator Event / State CAN Failure 1..0 Event/ CAN Bus State LINx Failure 1..0 Data Sheet 60 Rev. 1.0, 2009-03-31 TLE8262E Interrupt Function Table 11 Interrupt sources INT Activation 1) Interrupt sources Undervoltage at VCC2 (except during switch off ) Undervoltage at VCC3(except during switch off ) Over current at VCC3 (except during inhibition) Voltage at VCC2 (during switch on ) Voltage at VCC3 (during switch on ) SBC Failure SPI data corrupted Reset (SBC SW Development only) Wrong watchdog setting Wake Wake at CAN Wake at LIN Wake at WK Cyclic WK 1) 1) 1) SPI bit State Event / State Event Rising and falling Rising and falling Rising Rising Rising Rising Rising Rising Rising Rising Rising Rising UV_VCC2 UV_VCC3 ICC3 > ICC3MAX UV_VCC2 UV_VCC3 SPI Fail Reset Wrong WD set WK CAN WK LINx WK WK pin 1..0 Cyclic WK Event Event 1) When VCC2/3 is switched off no interrupt is generated due to the undervoltage at VCC2/3. When switching on VCC2/3 an interrupt is generated when the command is sent to the SBC via SPI. 12.1.1 Interrupt for switching on Vcc2 and Vcc3 The Interrupt for Vcc2 and Vcc3 are generated when the SPI command for switching on the voltage regulator is executed. The interrupt bit is set to "1" and can be cleared with a Read Only command after the under voltage threshold is reached. If the Read Only is done before the reset threshold is reached, the interrupt bit can not be cleared as the undervoltage condition is still present. In this case a second interrupt can be issued for releasing the undervoltage condition. In case of a short to GND on Vcc2 or Vcc3 the interrupt for switching on the voltage regulator is issued, but the C can not clear the interrupt bit as the voltage regulator does not reach the undervoltage threshold. 12.1.2 Example of Interrupt Events and Read-out The examples show single interrupt events. SPI read is done with "Read Only". The shown interrupts are not masked. Watchdog trigger is not shown in the examples. The interrupt UV_Vcc2 that is generated by switching on VCC2 is shown in Figure 27. The interrupt is sensitive on rising event only. Data Sheet 61 Rev. 1.0, 2009-03-31 TLE8262E Interrupt Function Vcc2 switched off by SPI Rising event (Vcc2 above limit) is shown Vcc2 switched on by SPI Vcc2 INT pin SPI DI programming Read Only Mode Select Bits 111 optional required optional Conf. Select 000 Conf. Select 001 Conf. Select 002 INT bit UV_VCC2 0 X X 0 1 X X 1 X X X 0 0 X Interrupt_ SwitchOn_ VCC2 .vsd Figure 27 Interrupt Vcc2 switch-on. Data Sheet 62 Rev. 1.0, 2009-03-31 TLE8262E Interrupt Function The interrupt UV_Vcc2 that is generated by an under-voltage on VCC2 is shown in Figure 28. The interrupt is sensitive on rising and falling event and the interrupt bit also shows the state of the device and function. Undervoltage on Vcc2 Falling event (Vcc2 below limit), rising event (Vcc2 above Limit) as well as state is shown Vcc2 INT pin SPI DI programming Read Only Mode Select Bits 111 required optional required optional Conf. Select 000 Conf. Select 001 Conf. Select 002 INT bit UV_VCC2 1 X X 1 X X X 1 1 X 1 X X 1 X X X 0 0 X Interrupt_UV_VCC2.vsd Figure 28 Interrupt VCC2 under-voltage. The interrupt OT_Vcc2 that is generated by an over temperature on VCC2 is shown in Figure 29. The interrupt is sensitive on rising event and the interrupt bit also shows the state of the device and function. Overtemperature on Vcc2 Rising event (apperance of overtemperature is ) shown, as well as the state. OT_VCC2 INT pin SPI DI programming Read Only Mode Select Bits 111 required optional Conf. Select 000 Conf. Select 001 Conf. Select 002 INT bit OT_VCC2 1 X X 1 X X X 1 1 X X 0 0 X Interrupt_OT_VCC2.vsd Figure 29 Interrupt Vcc2 Over Temperature. Data Sheet 63 Rev. 1.0, 2009-03-31 TLE8262E Interrupt Function 12.2 Interrupt Timing Figure 30 illustrates the interrupt timing. The INT output is set LOW as soon as an interrupt condition occurs. The INT pin is released after a SPI interrupt buffer read out command, that is performed with a Read Only command (111) to register (000). In case consecutive interrupt sources are indicated before the SPI read out, only one INT LOW will be raised but the SPI read out will indicate the interrupt sources. A time-out feature is implemented. The INT pin can be active LOW only for the time tINTTO. Afterwards, the INT pin is released but the INT source is still valid or present in the SPI register. Between two activations of the INT, there is at least a delay of tINTTO. If an interrupt occurs in the meantime, the information is stored and the INT will go LOW after tINTO. The INT pulse width is at minimum tINT. interrupt source 1 active inactive t interrupt source 2 active inactive INT output tINT tINT TO tINTTO tINTTO SPI read out SPI read out SPI read out SPI read out tINTTO t t interupt timing.vsd Figure 30 Interrupt Timing 12.3 Interrupt Modes with SBC Modes The interrupt function is possible only in SBC Normal and Stop Mode. After an SBC Restart Mode, all interrupt sources are enabled. 12.4 Interrupt Application Information By default, all interrupt sources are activated. Please refer to the dedicated chapter for the definition of the interrupt. The INT output is active for at least tINT, even if the corresponding interrupt register is read out immediately after the interrupt event occurs. If no SPI read is done after the interrupt is generated (INT pin low) the INT output becomes active (INT pin high) again after tINTTO. If two interrupt cases occur after each other and the SPI read (with read-only) is done after the second interrupt case, both interrupt bits are cleared. Although the interrupt bits for both interrupt cases are cleared the second interrupt will be issued by INT pin Low. This can lead to an interrupt where all interrupt bits are read as "0". Data Sheet 64 Rev. 1.0, 2009-03-31 TLE8262E Interrupt Function 12.5 . Electrical Characteristics VS = 5.5 V to 28 V; Tj = -40 C to +150 C; SBC Normal Mode; all voltages with respect to ground; positive current defined flowing into pin unless otherwise specified. Pos. Parameter Symbol Limit Values Min. Interrupt output; Pin INT 12.5.1 12.5.2 12.5.3 12.5.4 12.5.5 12.5.6 12.5.7 12.5.8 Interrupt delay Time-out INT pulse width INT Low Output Voltage INT High Output Voltage INT Pull-up Resistor INT Config LOW input voltage INT Config HIGH input voltage INT Config pull down Typ. 6 - 0.2 - 20 - - 250 Max. 6.6 - 0.4 ms s V V k V V k - 1) Unit Test Condition tINTTO tINT VINTOL VINTOH RINT VCFGLO VCFGHI RCFG 5.4 10 - 0.7 x VCC1C 10 0.3 x VCC1C + 0.3 V 40 - 0.7 x IINT = 1 mA IINT = -20A VINT = 0 V - - - Configuration select; Pin INT Vcc1C - - Vcc1C - 1) Not subject to production test, specified by design. Data Sheet 65 Rev. 1.0, 2009-03-31 TLE8262E Limp Home 13 13.1 13.2 Limp Home Description Limp Home output The Limp Home output is an active LOW open drain transistor, please refer to Figure 31; therefore, it is necessary to connect at least an external pull-up resistor at. The Limp Home output is activated due to a failure condition or via SPI, see Chapter 13.3. If Vs is below VLHUV, the Limp Home cannot be activated and remains as a high impedance. Limp home Limp home logic LIMP HOME.VSD Figure 31 Limp Home block diagram 13.2.1 Test Pin The Test pin is used to set the SBC chip into SBC Software Development Mode. When the Test pin is connected to GND, the SBC starts in SBC Software Development Mode. When the pin is left open, or connected to Vs the SBC starts into normal operation. Please refer to Figure 3. The Test pin has an integrated pull-up resistor (switched ON only during SBC Init Mode) to prevent the SBC device from starting in SBC Software Development Mode during normal life of the vehicle, as for example when the battery has been disconnected. To avoid disturbance, the Test pin is monitored during the Init Mode (from the time VS > VUVON until Init Mode is left). If the pin is low for the Init Mode time, Software Development Mode is reached. The mode is stored during the complete time where VS is above VUVOFF. It means to leave Software Development Mode, the SBC must go back to SBC OFF mode. Data Sheet 66 Rev. 1.0, 2009-03-31 TLE8262E Limp Home 13.3 Activation of the Limp Home Output The reason to activate the Limp Home pins and the consequences are listed in Table 12 and Table 13. Table 12 SBC Mode INIT Mode Normal Mode Stop Mode Sleep Mode Restart Mode Fail-Safe Mode SW Flash Mode Table 13 SBC Mode INIT Mode Normal Mode Restart Mode Limp Home, Function of the SBC Mode Limp Home Outputs OFF OFF Unchanged Unchanged Unchanged ON Unchanged ON via SPI ON if it was ON until the successful Watchdog setting and deactivation via SPI. Automatic Activation of Limp Home Output Reason INIT time-out (tINITTO) 1st Watchdog failure (config 1/2) 2nd Watchdog failure (config 3/4) Reset output permanent short circuit to Vcc1C Reset output permanent short circuit to GND Vcc1C undervoltage time-out Any mode If previously turned ON in SBC Normal Mode, via SPI command Vcc1C thermal shutdown 13.4 Release of the Limp Home Output When Limp Home is activated via SPI command, then it is released via SPI command. This is useful for diagnosis purpose for example. Otherwise, the Limp Home outputs are released only in SBC Normal Mode with the following conditions: After the device has been set to SBC Restart Mode, automatically entering SBC Normal Mode, a successful Watchdog trigger must be sent via SPI. At this point, the Limp Home outputs remain active. Then the microcontroller needs to send by SPI command the deactivation of the Limp Home. 13.5 Vcc1C undervoltage time-out A Vcc1C undervoltage time-out condition is given, when 1) the Vcc1C output voltage is below the reset threshold (VRT1, VRT2, VRT3), 2) VS is higher then the threshold (VSthUV1, VSthUV2, VSthUV3) and 3) the condition is valid longer then the Vcc1C under voltage time-out (tVcc1UVTO). A Vcc1C undervoltage time-out will sent the device into Fail-Safe Mode. Limp Home output stag will be activated (for Vs > VLHUV) Figure 32 gives an example of the Limp Home output activation, due to a Vcc1C undervoltage time-out. Data Sheet 67 Rev. 1.0, 2009-03-31 TLE8262E Limp Home Vs VSthUVx Vcc1C t VRTx VRTx GND RO tVcc1UVTO t SBC Sleep SBC Restart SBC Normal SBC Restart SBC Fail safe Limp home Wake Up tRDx tRR t GND undervoltage time out.vsd t Figure 32 Vcc1C undervoltage time-out timing Data Sheet 68 Rev. 1.0, 2009-03-31 TLE8262E Limp Home 13.6 Electrical Characteristics VS = 5.5 V to 28 V; Tj = -40 C to +150 C; SBC Normal Mode; all voltages with respect to ground; positive current defined flowing into pin unless otherwise specified. Pos. Parameter Symbol Limit Values Min. Limp Home; 13.6.1 Watchdog edge count difference to set Limp Home activated Limp Home low output voltage (active) Limp Home high output current (inactive) INIT Time-out Vcc1C under voltage Time-out Typ. 1 2 Max. - - With SPI set. Default Setting 0.4 2 - 1150 6.3 5.3 5.0 5.5 - V A ms ms V V V V V ILH = 1mA VLH = 28V 1) Unit Test Condition nLH - 13.6.2 13.6.3 13.6.4 13.6.5 13.6.6 VLHLO ILHHI - 0.2 - 256 1024 - - - - 0.2 0 tINITTO - tVcc1UVTO 900 VSthUV1 5.3 4.3 4.0 4.5 Vs threshold for Vcc1C VRT1 default setting VRT2 SPI option VRT3 SPI option - - under voltage Time-out (Vs needs to be above, to V SthUV2 activate Vcc1C under VSthUV3 voltage Time-out) 13.6.7 13.6.8 Test 13.6.11 13.6.12 13.6.13 13.6.14 HIGH Level Input Voltage VTest,HI Threshold Input Hysteresis LOW Level Input Voltage Threshold Pull-up Resistor Threshold for Limp Home VLHUV minimum Vs Limp Home Vs voltage hysteresis VLHUVhys - - 100 1 20 - 300 - 40 3 700 - 80 V mV V k - - - VTest,hys VTest,LO RTest VLH_PL/Test = 0V SBC Init Mode 1) Not subject to production test, specified by design. Data Sheet 69 Rev. 1.0, 2009-03-31 TLE8262E Configuration Select 14 14.1 Configuration Select Configuration select The Configuration select is used to set the device for two different SBC behaviors; please refer to Chapter 4.2.1 for detailed information. Depending on the requirements of the application, the Vcc1C is switched off and the device goes to Fail-Safe Mode in case of watchdog fail (1 or 2 fail) or reset clamped. To turn Vcc1C OFF (Config 2/4), the INT pin is not connected to a pull up resistor externally. In case the Vcc1C is not switched off (Config 1/3) the INT pin is connected to Vcc1C with a pull up resistor. The configuration is only read during Init Mode, after that the configuration is stored. 14.2 Config Hardware Descriptions In Init Mode before the RO pin goes high the INT pin is pulled to low with a weak pull down resistor RCFG, the pull up resistor RINT is switched off. When Vcc1C is high, above the reset threshold VRT1 and before the RO pin goes high the level on the INT pin is monitored to select the configuration. With RO going high in Init Mode the pull up resistor RINT is switched on. Figure 33 gives the electrical equivalents to the configuration function of the INT pin. Vc c 1C Configuration logic R INT Interrupt logic Time out R CFG INT INTERRUPT BLOCK_CONFIG.VSD Figure 33 Config Logic Diagram Electrical characteristics are listed in chapter Chapter 12.5 Data Sheet 70 Rev. 1.0, 2009-03-31 TLE8262E Serial Peripheral Interface 15 15.1 Serial Peripheral Interface SPI Description The 16-bit wide Control Input Word is read via the data input SDI, which is synchronized with the clock input CLK supplied by the microcontroller. The output word appears synchronously at the data output SDO (see Figure 34). The transmission cycle begins when the chip is selected by the input CSN (Chip Select Not), LOW active. After the CSN input returns from LOW to HIGH, the word that has been read in becomes the new control word. The SDO output switches to tri-state status (high impedance) at this point, thereby releasing the SDO bus for other use. The state of SDI is shifted into the input register with every falling edge on CLK. The state of SDO is shifted out of the output register after every rising edge on CLK. The number of received input clocks is supervised by a modulo-16 operation and the Input / Control Word is discarded in case of a mismatch. This error is flagged in the following SPI output by a "HIGH" at the data output (SDO pin, bit FO) before the first rising edge of the clock is received. The SPI of the SBC is not daisy chain capable. CSN high to low: SDO is enabled. Status information transferred to output shift register CSN time CSN low to high: data from shift register is transferred to output functions CLK time Actual data SDI FI 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 SDI: will accept data on the falling edge of CLK signal Actual status SDO FO 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 SDO: will change state on the rising edge of CLK signal Figure 34 SPI Data Transfer Timing New data FI 01 ++ time New status FO 0 + 1 + time 15.2 Corrupted data in the SPI data input When the microcontroller send a wrong SPI command to the SBC, the SBC ignores the information. Wrong SPI command can be either a number of bits different of 16, the mode selection (MS2..0) = 000 or requesting to go to an SBC mode which is not allowed by the state machine, for example from SBC Stop Mode to SBC SW Flash Mode. In that case, an interrupt is generated (if not inhibited) and the bit SPI Fail is set. Since the SPI data is corrupted, the next SPI output data will remain the former one (the information is then repeated). Data Sheet 71 Rev. 1.0, 2009-03-31 TLE8262E Serial Peripheral Interface 15.3 SPI Input Data MSB LSB Input Data 15 14 13 12 11 10 WD refresh 9 8 7 6 5 CS2 4 CS1 3 CS0 2 MS2 1 MS1 0 MS0 Configuration Registers Res. Res. Res. WK 1 WK 0 Res. WK pin WK pin Res. WK LIN1 WK CAN Configuration Select Mode Selection Bits not valid Restart SW Flash Normal Sleep Stop Fail safe Read Only 000 000 Wrong Reset WD set Fail SPI INTERRUPT MASK ICC3 > ICC3max UV Vcc3 UV VCC2 OT VCC2 CAN Bus OT HS CAN OTP Vcc1C 001 001 Res. Res. Res. Res. LIN1 LIN1 failure failure 1 0 CAN CAN failure failure 1 0 010 010 Reserved WD to LH Cyclic L.H. VCC2 WK PIN VCC3 Reset WK On/off On/Off On/off On/off Delay On/off CAN 1 CAN 0 011 011 RT1 RT0 100 100 REGISTER LIN 10.4k Res. Res. Res. Res. LIN1 1 LIN 1 0 101 101 Ti. CHK WD Out / SUM On/Off Win . Set to 1 Window /Time out Watchdog Timing Bit Position: 10 .. 6 Test 2 Test 1 Test 0 110 110 LH Reserved 0 2 LH 1 LH 111 111 SPI data input TLE8262.vsd Figure 35 16-Bit SPI Input Data / Control Word Data Sheet 72 Rev. 1.0, 2009-03-31 TLE8262E Serial Peripheral Interface 15.4 SPI Output Data MSB LSB Output 15 14 13 12 11 10 Data WK state 9 8 7 6 5 CS2 4 CS1 3 CS0 2 MS2 1 MS1 0 MS0 Configuration Registers INT Res. Cyclic WK 1 WK 0 Res. WK WK pin WK pin Res. WK LIN1 WK CAN Configuration Select Mode Selection Bits Init Restart SW Flash Normal Sleep Stop Fail Safe Reserved 000 000 Status or INTERRUPT event Wrong Reset WD set Fail SPI ICC3 > ICC3max UV Vcc3 UV VCC2 OT VCC2 OT HS CAN OTP Vcc1C 001 001 Res. Res. Res. Res. LIN1 LIN1 failure failure 1 0 CAN Bus CAN CAN failure failure 1 0 010 010 Reserved WD to LH Cyclic L.H. VCC2 WK PIN VCC3 Reset WK On/off On/Off On /off On/off Delay On/off CAN 1 CAN 0 Ti. Out / Win. 011 011 RT1 RT0 100 100 LIN 10.4k Res. Res. Res. Res. LIN1 1 LIN 1 0 101 101 REGISTER CHK WD SUM On/Off Set to 1 Window /Time out Watchdog Timing Bit Position: 10 .. 6 LH 1 LH 0 Test 2 Test 1 Test 0 110 110 Res. RM1 RM0 LH 2 111 111 SPI_Settings_out_TLE8262.vsd Figure 36 16-bit SPI Output Data / Control Word 15.5 15.5.1 SPI Data Encoding WD Refresh bit / WK state The WD Refresh bit is used to trigger the Watchdog. The first trigger should be a 1, and then a 0. For more details, please refer to Chapter 11.2. The WK state bit gives the voltage level at the WK pin. A 1 indicates a high level, a 0 a low level. Data Sheet 73 Rev. 1.0, 2009-03-31 TLE8262E Serial Peripheral Interface 15.5.2 15.5.2.1 SBC Configuration Setting and Read Out Mode selection bits and configuration select Table 14 lists the encoding of the possible SBC mode. Except SBC Restart and Init Mode which are most of time entered automatically, all others SBC mode are accessible on request of the microcontroller. The microcontroller should send the correct mode selection bits to set the SBC in the respective mode. The output indicates the SBC mode where the SBC currently is or was, depending on the situation. Table 14 MS2 0 0 0 0 1 1 1 1 0 0 1 1 0 0 1 1 Mode Selection Bits Data Input Set the SBC to SBC Restart Mode. (In SW Flash mode only) Set the SBC to Software Flash Mode Set the SBC to SBC Normal Mode Set the SBC to SBC Sleep Mode Set the SBC to SBC Stop Mode Data Output Show the device was in Restart previous SPI data Show the device is SBC Software Flash Mode Show the device is in SBC Normal Mode Show the device was in SBC Sleep Mode Show the device is in SBC Stop Mode 0 1 0 1 0 1 0 1 Not valid (the complete SPI word is ignored) Show the device was in Init previous SPI data MS1 MS0 Set the SBC to SBC Fail-Safe Mode Show the device was in SBC Fail-Safe Mode (In SBC Software Development mode only) Set the SBC to Read Only SPI access. The Reserved configuration register needs to be selected. The SPI information on SDO is provided in the same SPI frame. No write access is done in this mode. Bit 15 (Watchdog) has to be served correctly. Table 15 lists the eight possible configuration selection. Some are related to event or state of the different part of the SBC, others are used to configure the SBC in the application specific set up. Table 15 CS2 0 0 0 0 1 1 1 1 CS1 0 0 1 1 0 0 1 1 Configuration Select Encoder (for Data Input and Output) CS0 0 1 0 1 0 1 0 1 Configuration Register Select Wake Register Interrupt SBC Failure Interrupt Communication Failure Interrupt Reserved SBC Configuration Register Communication Setup Register Watchdog Configuration Register Limp Home / Diagnosis Register Data Sheet 74 Rev. 1.0, 2009-03-31 TLE8262E Serial Peripheral Interface 15.5.2.2 Interrupt Register Encoder Table 16 lists all interrupts the SBC can generates. The microcontroller should read the correct register to release the INT pin. By default, all interrupt sources are enabled. The microcontroller can decide to inhibit a specific interrupt source. Table 16 CS Interrupt Register encoder 1) Default Value (INPUT) 1 1 11 Default Value (OUT) Bit Name Data Input Data Output Configuration select 000 (Wake register interrupt) 000 WK CAN WKLINx WK 1 WK pin WK 0 WK pin 0 0 00 Interrupt enabled (1) disabled (0) for wake event on CAN Interrupt enabled (1) disabled (0) for wake event on LIN Interrupt enabled (1) disabled (0) for wake pin event. 00 No interrupt 10 Interrupt for a LOW to HIGH transition on WK 01 Interrupt for HIGH to LOW transition on WK 11 Interrupt for both HIGH to LOW and LOW to HIGH on WK n.a n.a Wake on CAN (1) Wake on LINx (1) Wake on WK pin 00 No wake 10 Interrupt for a LOW to HIGH transition on WK 01 Interrupt for HIGH to LOW transition on WK 11 Interrupt for both HIGH to LOW and LOW to HIGH on WK Cyclic WK (1) Indicates that there is a status bit or uncleared event in configuration select 001 and/or 010. If set read the two register Cyclic WK INT n.a n.a 0 0 Data Sheet 75 Rev. 1.0, 2009-03-31 TLE8262E Serial Peripheral Interface Table 16 CS Interrupt Register encoder (cont'd)1) Default Value (INPUT) 1 1 1 1 Default Value (OUT) Bit Name Data Input Data Output Configuration select 001 (SBC Failure interrupt) 001 OTP_Vcc1C OT_HSCAN OT_Vcc2 UV_Vcc3 0 0 0 0 Interrupt enabled (1) disabled Vcc1C temperature pre warning (0) for temperature pre-warning (1) Interrupt enabled (1) disabled (0) for temperature shutdown Interrupt enabled (1) disabled (0) for temperature shutdown HS CAN temperature shutdown (1) Vcc2 temperature shutdown (1) Interrupt enabled (1) disabled Undervoltage detection on Vcc3 (0) for undervoltage detection (1) or due to back to normal voltage Interrupt enabled (1) disabled (0) for SPI corrupted data. Interrupt enabled (1) disabled (0) for reset information (only in SBC Software Development Mode) Interrupt enabled (1) disabled (0) for incorrect Watchdog setting SPI input corrupted data (1) Reset (1) (only in SBC Software Development Mode) Incorrect WD programming for data output SPI Fail Reset 1 1 0 0 Wrong WD set 1 0 UV Vcc2 1 0 Interrupt enabled (1) disabled Under voltage detected at Vcc2 (0) for undervoltage detection at Vcc2 ICC3 > ICC3max 1 0 Interrupt enable (1) disabled (0) Over current detected at Vcc3 for over current at Vcc3 Interrupt enabled (1) disabled (0) for CAN failure Interrupt enabled (1) disabled (0) for CAN bus failure Interrupt enabled (1) disabled (0) for LIN failure CAN failure Refer to Table 17 CAN bus failure detected (1) LIN failure. Refer to Table 17 Configuration select 010 (Communication failure interrupt) 010 CAN failure 1 CAN failure 0 CAN Bus LINx failure 1 LINx failure 0 n.a 1 1 n.a 1 0 0 0 0 0 1) A value of 0 will set the SBC into the opposite state. Data Sheet 76 Rev. 1.0, 2009-03-31 TLE8262E Serial Peripheral Interface 15.5.2.3 Table 17 0 0 1 1 CAN / LIN failure encoder CAN / LIN Failure Encoder 0 1 0 1 No failure TxD shorted to GND or bus dominant clamped RxD shorted to Vcc TxD shorted to RxD Table 17 describes the encoding of the possible internal CAN and LIN failures. CAN / LINx 1 Failure CAN / LINx 0 Failure Fault 15.5.2.4 Configuration encoder Table 18 lists the configuration register of the SBC. The microcontroller can change the settings. If no settings are changed the default values are used. The current value can be read on the SPI Data Out. Table 18 Configuration Encoder Default Default Value Value (INPUT) (OUT) 01 1 0 0 0 0 01 1 0 1 0 0 0 State Configuration Bit Name Select Configuration select 100 (SBC Configuration Register) 100 RT10 Reset delay Reset threshold setting. Please refer to Table 19 Long reset window Vcc3 ON /OFF Vcc2 On / Off LH ON / OFF Cyclic WK On / Off WD to LH Vcc3 is activated (1) The wake pin will wake the SBC WK pin ON / OFF 1 Vcc2 is activated (1) Limp Home output state. Activated (1) when entry condition is met. Activation (1) of the cyclic wake 1 1 Watchdog failure to Limp Home active. 0 = only one Watchdog failure brings to Limp Home activated. 1 = two consecutive Watchdog failures bring to Limp Home activated. Data Sheet 77 Rev. 1.0, 2009-03-31 TLE8262E Serial Peripheral Interface Table 18 Configuration Encoder Default Default Value Value (INPUT) (OUT) 1 00 1 00 State Configuration Bit Name Select Configuration select 101 (SBC communication set up register) 101 LIN 10.4k CAN 1.0 LIN cells are in LIN Low slope Mode (1) The CAN cell is in: 00 = CAN OFF 01 = CAN is Wake Capable 10 = CAN Receive Only Mode 11 = CAN Normal Mode The LIN cell is in: 00 = LIN OFF 01 = LIN is Wake Capable 10 = LIN Receive Only Mode 11 = LIN Normal Mode Time-out Watchdog is activated Bit is reserved and fix set to "1". Set to 1 in SW. Watchdog is activated Check sum of the bit 13...6 In case the CHK SUM is wrong, the device remains in previous valid state. CHKSUM = Bit13 ... Bit6 LINx 1.0 00 00 Configuration select 110 (SBC Watchdog register) 110 Ti. Out / Win. Set to 1 WD ON / OFF CHK SUM 1 1 1 1 1 1 1 1 Configuration select 111 (Limp Home / Diagnosis register) 111 Reserved for input For output, refer to Table 21, Table 22 and Table 23 15.5.2.5 Reset encoder Table 19 lists the three possible reset thresholds. Please also refer to Chapter 11.3 to get the exact voltage threshold. Table 19 RT1 0 0 1 1 0 1 0 1 Reset Encoder RT0 Threshold Selected Not Valid. Device remains at previous threshold VRT1 (default setting at SBC Init), VRT2 VRT3 15.5.2.6 SBC Watchdog encoder Table 20 list the 32 possible watchdog timer. Data Sheet 78 Rev. 1.0, 2009-03-31 TLE8262E Serial Peripheral Interface Table 20 Bit 10...6 00000 00001 00010 ... 01111 10000 10001 ... 11110 11111 Watchdog Encoder Decimal calculation (ms) 0 1 2 ... 15 16 17 ... 30 31 n x 48 - 464 (n+1) x 16 n = decimal value of setting Timer (ms) 16 32 48 ... 256 (default setting) 304 352 ... 976 1024 15.5.3 SBC Diagnostic encoder The SBC offers diagnostics information. The encoding of the different possible failures are listed in the following table. The description apply only to data output. 15.5.3.1 Reason for restart and reset Reason for reset, without activation of the Limp Home and the way it is encoded are summed up in Table 21. The bits are cleared by reading the register with Read-Only command. When coming from Sleep Mode or Fail Safe Mode the bits are cleared. Table 21 RM1 0 0 1 1 Reason to Enter SBC Restart Mode without Limp HomeLimp Home activation RM0 0 1 0 1 Cause for entering SBC Restart Mode No reset has occurred or Limp Home activated Undervoltage on Vcc1C First Watchdog failure (config 3 and 4) or no acknowledge of the Cyclic Wake-up SPI command in SBC Software Flash Mode or reset low from outside Data Sheet 79 Rev. 1.0, 2009-03-31 TLE8262E Serial Peripheral Interface 15.5.3.2 Limp Home failure encoder Table 22 describes the encoding of all possible reason to activate automatically the Limp Home output. Bits are set back to "000" when switching Limp Home off via SPI. Table 22 LH2 0 0 0 0 1 1 1 1 0 0 1 1 0 0 1 1 Limp Home Failure Diagnosis LH1 LH0 0 1 0 1 0 1 0 1 Failure1) No failure Vcc1C undervoltage Time-out One Watchdog failure (config 1 and 2) Two consecutive Watchdog failures (config 3 and 4) INIT Mode Time-out Temperature shutdown at Vcc1C Reset clamped Reserved 15.5.3.3 Test pin and failure to Limp Home configuration read out The SBC allows to read the hardware setting of the configuration that is done via the INT pin, as well as the test pin and the WD to LH bit. Table 23 describes the encoding of these informations. Table 23 Test2 0 0 0 0 1 1 1 1 0 0 1 1 0 0 1 1 Test pin and SBC Configuration Test1 Test0 0 1 0 1 0 1 0 1 Test Read Out1) Vcc1C remains ON in SBC Restart Mode after one Watchdog failure (config 1) Vcc1C is OFF in SBC Fail-Safe Mode after one Watchdog failure (config 2) Vcc1C remains ON in SBC Restart Mode after two Watchdog failures (config 3) Vcc1C is OFF in SBC Fail-Safe Mode after two Watchdog failures (config 4) Software Development Mode. In case of watchdog failure Vcc1C remains ON, no reset is generated and Restart Mode or Fail-Safe Mode are not entered. Software Development Mode. In case of watchdog failure Vcc1C remains ON, no reset is generated and Restart Mode or Fail-Safe Mode are not entered. Software Development Mode. In case of watchdog failure Vcc1C remains ON, no reset is generated and Restart Mode or Fail-Safe Mode are not entered. Software Development Mode. In case of watchdog failure Vcc1C remains ON, no reset is generated and Restart Mode or Fail-Safe Mode are not entered. 1) Refer also to Chapter 4.2.1 Data Sheet 80 Rev. 1.0, 2009-03-31 TLE8262E Serial Peripheral Interface 15.6 15.6.1 SPI Output Data First SPI output data Since the SPI output data is sent when the SBC is receiving data, the output data are dependent of the previous SPI command, if no Read Only command is used. Under some conditions there is no "previous command". Table 24 gives the first SPI output data that is sent to the microcontroller when entering SBC Normal Mode, depending on the mode where the SBC was before receiving the first SPI command. . Table 24 Sleep mode First SPI output data frame Mode selection bits (MS2...0) Configuration select (CS 2..0) Sleep mode Fail-Safe mode Restart mode Restart mode Init mode Wake Register interrupt1) Limp Home register1) Limp Home register1) SBC Configuration Register SBC Configuration Register Previous SBC mode Fail-Safe mode Restart mode when failure and config 1 / 3 Restart mode when microcontroller has sent to Restart mode SBC Init mode 1) This does not clear the bits. It will be reset when the microcontroller requests the read out Data Sheet 81 Rev. 1.0, 2009-03-31 TLE8262E Serial Peripheral Interface 15.6.2 Read Only command In the Mode Selection Bits a Read Only can be selected. The Read Only access clears the INT bits that are selected in the Configuration Select (some interrupt bits show a state, and can not be cleared with a SPI read). With this SPI command no write access is done to the SBC, and the mode of the SBC is not changed. The watchdog can also be triggered with a Read Only command. The Read Only command delivers the information requested with the Configuration Select in the same SPI command on the SDO pin. As all other SPI commands deliver the requested information with the next SPI command. Figure 37 shows an example of a Read Only access. The bits are shown with LSB first, on the left side in difference to the register description. DI DI 0 MS0 1 MS1 2 MS2 3 CS0 4 CS1 5 CS2 6 7 8 9 10 11 12 13 14 15 0 MS0 1 MS1 2 MS2 3 CS0 4 CS1 5 CS2 6 7 8 9 10 11 12 13 14 15 Mode Selection Bits Configuration Select Configuration Registers x x x x x x x x x WD refresh Mode Selection Bits Configuration Select Configuration Registers x x x x x x x x x WD refresh 1 1 1 0 0 0 x 1 1 0 1 1 1 x DO 0 MS0 1 MS1 2 MS2 3 CS0 4 CS1 5 CS2 6 7 8 9 10 11 12 13 14 15 DO 0 MS0 1 MS1 2 MS2 3 CS0 4 CS1 5 CS2 6 7 8 9 10 11 12 13 14 15 Mode Selection Bits Configuration Select Configuration Registers x x x x x x x x x WK state Mode Selection Bits Configuration Select Configuration Registers x x x x x x x x x WK state 1 1 0 0 0 0 x 1 1 0 1 0 0 x TIME Figure 37 Read Only Command Figure 38 shows an example of an SPI write access in normal mode for comparison. The requested information is sent out with the next SPI command. DI DI 0 MS0 1 MS1 2 MS2 3 CS0 4 CS1 5 CS2 6 7 8 9 10 11 12 13 14 15 0 MS0 1 MS1 2 MS2 3 CS0 4 CS1 5 CS2 6 7 8 9 10 11 12 13 14 15 Mode Selection Bits Configuration Select Configuration Registers x x x x x x x x x WD refresh Mode Selection Bits Configuration Select Configuration Registers x x x x x x x x x WD refresh 1 1 0 0 0 0 x 1 1 0 1 1 1 x DO 0 MS0 1 MS1 2 MS2 3 CS0 4 CS1 5 CS2 6 7 8 9 10 11 12 13 14 15 DO 0 MS0 1 MS1 2 MS2 3 CS0 4 CS1 5 CS2 6 7 8 9 10 11 12 13 14 15 Mode Selection Bits Configuration Select Configuration Registers x x x x x x x x x WK state Mode Selection Bits Configuration Select Configuration Registers x x x x x x x x x WK state 1 1 0 1 0 0 x 1 1 0 0 0 0 x TIME Figure 38 Write Command Data Sheet 82 Rev. 1.0, 2009-03-31 TLE8262E Serial Peripheral Interface 15.7 Electrical Characteristics VS = 5.5 V to 28 V; Tj = -40 C to +150 C; SBC Normal Mode; all voltages with respect to ground; positive current defined flowing into pin; unless otherwise specified. Pos. Parameter Symbol Min. SPI Interface; Logic Inputs SDI, CLK and CSN 15.7.1 15.7.2 15.7.3 15.7.4 15.7.5 15.7.6 H-input Voltage Threshold VIH L-input Voltage Threshold VIL Hysteresis of input Voltage Pull-up Resistance at pin CSN Pull-down Resistance at pin SDI and CLK Input Capacitance at pin CSN, SDI or CLK H-output Voltage Level L-output Voltage Level - 0.3 x - - 0.12 x 0.7 x V V V 80 80 k k pF - - -1) Limit Values Typ. Max. Unit Test Condition VCC1C - VCC1C VCC1C 20 40 40 10 VIHY RICSN VCSN = 0.7 x VCC1C VSDI/CLK = 0.2 x VCC1C -1) RICLK/SDI 20 CI - Logic Output SDO 15.7.7 15.7.8 15.7.9 15.7.10 VSDOH VSDOL VCC1C - VCC1C - - 0.4 - -10 - 0.2 0.2 - 10 0.4 10 15 V V A pF IDOH = -1.6 mA IDOL = 1.6 mA VCSN = VCC1C; 0 V < VDO < VCC1 1) Tri-state Leakage Current ISDOLK Tri-state Input Capacitance Clock Period Clock High Time Clock Low Time Clock Low before CSN Low CSN Setup Time CLK Setup Time CSDO Data Input Timing1) 15.7.11 15.7.12 15.7.13 15.7.14 15.7.15 15.7.16 15.7.17 15.7.18 15.7.19 tpCLK tCLKH tCLKL tbef tlead tlag 250 125 125 125 250 250 125 100 50 - - - - - - - - - - - - - - - - - - ns ns ns ns ns ns ns ns ns - - - - - - - - - Clock Low after CSN High tbeh SDI Set-up Time SDI Hold Time tDISU tDIHO Data Sheet 83 Rev. 1.0, 2009-03-31 TLE8262E Serial Peripheral Interface 15.7 Electrical Characteristics (cont'd) VS = 5.5 V to 28 V; Tj = -40 C to +150 C; SBC Normal Mode; all voltages with respect to ground; positive current defined flowing into pin; unless otherwise specified. Pos. 15.7.20 15.7.21 15.7.22 Parameter Input Signal Rise Time at pin SDI, CLK and CSN Input Signal Fall Time at pin SDI, CLK and CSN Delay Time for Mode Change from Normal Mode to Sleep Mode CSN High Time SDO Rise Time SDO Fall Time SDO Enable Time SDO Disable Time SDO Valid Time Symbol Min. Limit Values Typ. - - - Max. 50 50 10 ns ns s - - - - - - Unit Test Condition trIN tfIN tfIN 15.7.23 15.7.24 15.7.25 15.7.26 15.7.27 15.7.28 tCSN(high) 10 trSDO tfSDO tENSDO tDISSDO tVASDO - - - - - - 30 30 - - - - 80 80 50 50 60 s ns ns ns ns ns CL = 100 pF CL = 100 pF low impedance high impedance CL = 100 pF Data Output Timing 1) 1) Not subject to production test; specified by design 23 CSN 14 CLK 18 DI not defined 26 DO Flag 28 LSB MSB LSB 19 MSB 27 15 12 13 16 17 Figure 39 SPI Timing Diagram Note: Numbers in drawing correlate to the last 2 digits of the Pos. number in the Electrical Characteristics table. Data Sheet 84 Rev. 1.0, 2009-03-31 TLE8262E Application Information 16 Application Information Note: The following information is given only as a hint for the implementation of the device and should not be regarded as a description or warranty of a certain functionality, condition or quality of the device. VDD VBAT VBAT C1 C2 C3 C12 VS T1 IC2 D1 R1 VIO V CC GND VS D2 VCC IC3 C13 GND R2 BUS1 C4 Bus 1 VS V CC3shunt VS V CC3base VCC3ref VDD V cc1C C9 TEST C 10 R12 TLE8262 S2 CSN VDD CLK SDI C SDO TxD LIN 1 RxD LIN1 CSN CLK SDO SDI TxD LIN 1 RxD LIN 1 LOGIC State Machine TxD CAN RxD CAN INT S1 WK R9 R5 C7 CAN cell VBAT TxD CAN RxD CAN INT Reset VSS V DD RO VS WK VCC2 R 10 VCCHSCAN C 11 CANH R7 C8 R8 CANL SPLIT CANH VS C14 VBAT VDD VBB CS SCLK SI SO LHI IN0 IN1 IN2 IN3 IN4 IN5 IC1 CANL Limp home T2 DEVICE GROUND GND D5 GND Application _information _TLE8262 E.vsd Figure 40 Application Example for a Body Controller Module Data Sheet 85 Rev. 1.0, 2009-03-31 TLE8262E Application Information Note: This is a very simplified example of an application circuit and bill of material. The function must be verified in the actual application. Table 25 Ref. C1 C2 C3 C5 C7 C8 C9 C10 C11 C12 C13 C14 R1 R3 R5 R7 R8 R9 R10 R12 Bills of material Option Vendor Y Kemet Y N N Y Y Y N N Y Y Y N Y Y Y Y Y Y Y Murata Value 68F optional depending on application 100nF 10F ceramic cap low ESR 1nF OEM dependent 22nF 50V 47nF OEM dependent 10F 100nF 10F CAN transceiver dependent 100nF 100nF 100nF 220m 1k / OEM dependent 1k 60 / OEM dependent 60 / OEM dependent 10k 500 47k Purpose Cut off battery spike EMC Stability of the VCC3 LIN Master Termination EMC Improve SPLIT pin stability Buffer of the VCC1C depending on load. (C) Stability of the VCC1C Buffering of the VCC2 for CAN Transceiver Improve stability of the logic Improve stability of the logic Improve stability of the logic Capacitance Resistance VCC3 current measurement for ICC3 400mA max LIN master termination Wetting current of the switch CAN bus termination CAN bus termination Limit the WK pin current in ISO pulses Insulation of the VDD supply Set config 1/3. If not connected config 2/4 is selected Data Sheet 86 Rev. 1.0, 2009-03-31 TLE8262E Application Information Table 25 Ref. T1 Bills of material Option Vendor N ON Semi Infineon T2 D1 D3 C IC1 IC2 IC3 N N N N Y Y Y Infineon Infineon Infineon Infineon Infineon Infineon Infineon Value MJD253 BCP52-16 BCR191W BAS 3010A BAS70 06 (dual) BAS70 (single) XC2xxx SPOC - BTS5672E TLE 6254-3G TLE 6251DS Purpose Power element of VCC3 Alternative power element of VCC3, current limit to be adapted R1 to be changed. High active Limp Home Reverse polarity protection Requested by LIN norm. Protect the application in reverse polarity. micro-controller high side switches Low speed CAN High speed CAN Active components Data Sheet 87 Rev. 1.0, 2009-03-31 TLE8262E Application Information 16.1 ZthJA Curve 60 Zth-JA(Ch4; 600) Zth-JA(Ch4; 300) Zth-JA(Ch4; 100) 40 Zth-JA [K/W] 50 Zth-JA(Ch4; footprint) 30 20 10 0 0,00001 0,0001 0,001 0,01 0,1 tim e (s) 1 10 100 1000 10000 Zthja curves.vsd Figure 41 ZthJA Curve, Function of Cooling Area 600mm cooling area 300mm cooling area 100mm cooling area minimum footprint PCB set up.vsd Figure 42 Board Set-up Board set-up is done according to JESD 51-3, single layer FR4 PCB 70 m. Data Sheet 88 Rev. 1.0, 2009-03-31 TLE8262E Application Information 16.2 Hints for SBC Factory Flash Mode The mode is used during production of the module to flash the C. The idea is that the C is not supplied from the SBC but from an external 5V power supply. The reset of the C that is connected to the RO pin of the SBC can be driven from an external source and the SBC does not give a reset signal. Also no interrupt at the pin INT and no signal on the SPI SDO pin is generated by the SBC. The SPI pins can be driven externally. The mode is reached by applying 5V to the VCC1C pin and no voltage to the Vs pin. The Vs pin will show a voltage of about 4.5V because of the internal diode from VCC1C to Vs. The current drawn at Vs must not exceed the maximum rating of Ivs,max = -500mA. The function is designed for ambient temperature. In case the Vs was supplied before going to FF Mode, the voltage on pin Vs must be set below 3 V before applying 5V to VCC1C (discharging the C) Not supplied Not supplied 5V Reset signal VBAT C Vs IVS Internal supply VCC1C The current flowing to other devices from Vs should be limited to not exceed the maximum ratings. Other Devices CSN CLK SDO SDI TxD LIN1 RxD LIN1 TxD LIN2 RxD LIN2 TxD LIN3 RxD LIN3 TxD CAN RxD CAN INT RO CSN V DD CLK SDI C SDO TxD LIN1 RxD LIN1 TxD LIN2 RxD LIN2 TxD LIN3 RxD LIN3 TxD CAN RxD CAN INT Reset V SS Application_ FF_Mode _2.vsd Figure 43 Application Hint for Factor Flash Mode Data Sheet 89 Rev. 1.0, 2009-03-31 TLE8262E Application Information Table 26 Pin Vs Vcc1C RO INT LH SDO CLK, SDI CSN PIN in Factory Flash Mode Level typ. 4.5V 5V 2% Pull-up resistor Pull-up resistor High impedance High impedance Pull-down resistor Pull-up resistor Pull-up resistor High impedance Comment Voltage output from SBC. No voltage applied from external. To be applied from external Can be driven from external Can be driven from external if required Can be driven from external if required Can be driven from external if required Can be driven from external if required Can be driven from external if required Can be driven from external if required Can be driven from external if required TxDCAN, TxDLIN1, TxDLIN2, TxDLIN3 RxDCAN, RxDLIN1, RxDLIN2, RxDLIN3 16.3 ESD Tests Tests for ESD robustness according to IEC61000-4-2 "gun test" (150pF, 330) have been performed. The results and test condition is available in a test report. The values for the test are listed in Table 27 below. Table 27 ESD "Gun test" Result >8 < -8 Unit Remarks positive pulse1) Performed Test ESD at pin CANH, CANL, BUSx, Vs versus GND ESD at pin CANH, CANL, BUSx, Vs versus GND kV kV negative pulse 1) ESD susceptibility "ESD GUN" contact discharge (R=330Ohm C=150pF) (DIN EN 61000-4-2) tested according LIN EMC 1.3 Test Specification and ICT EMC Evaluation of CAN Transceiver. Tested by external test house (IBEE Zwickau, EMC Test report Nr. 06-02-09a) Data Sheet 90 Rev. 1.0, 2009-03-31 TLE8262E Package Outline 17 Package Outline 0...0.10 STAND OFF 2.45 -0.2 2.55 MAX. 3) 0.35 x 45 0.65 C 17 x 0.65 = 11.05 0.33 0.08 2) 0.1 C 36x SEATING PLANE 1.1 0.7 0.2 10.3 0.3 D 0.17 M A-B C D 36x A 19 Bottom View 19 36 36 Ejector Mark Cavity ID Exposed Diepad Y 1 18 18 B 12.8 -0.21) Index Marking Ejector Mark Polish Finish X 1 Index Marking Exposed Diepad Dimensions 4) Leadframe X Y Package PG-DSO-36-24, -41, -42 A6901-C001 7 5.1 A6901-C003 7 5.1 PG-DSO-36-38 A6901-C007 5.2 4.6 PG-DSO-36-38 PG-DSO-36-24 A6901-C008 6.0 5.4 1) Does not include plastic or metal protrusion of 0.15 max. per side 2) Does not include dambar protrusion of 0.05 max. per side 3) Distance from leads bottom (= seating plane) to exposed diepad 4) Exclunding the mold flash allowance of 0.3mm MAX per side PG-DSO-36-24, -38, -41, -42-PO V08 Figure 44 PG-DSO-36-38 (Leadframe A6901-003);) Note: For the SBC product family the package PG-DSO-36-38 with the leadframe A6901-C003 is used. Green Product (RoHS compliant) To meet the world-wide customer requirements for environmentally friendly products and to be compliant with government regulations, the Universal System Basis Chip is available as a green product. Green products are RoHS-Compliant (i.e Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD020). For information about packages and types of packing, refer to the Infineon Internet Page "Products": http://www.infineon.com/products. Data Sheet 91 8 MAX. 7.6 -0.2 1) 0.23 +0.09 Dimensions in mm Rev. 1.0, 2009-03-31 TLE8262E Revision History 18 Version 1.0 Revision History Date Parameter Changes First Rev. after Preliminary Data Sheet Data Sheet 92 Rev. 1.0, 2009-03-31 Edition 2009-03-31 Published by Infineon Technologies AG 81726 Munich, Germany (c) 2009 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. |
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